具有片上无线链路的可持续多核架构

Jacob Murray, John Klingner, P. Pande, B. Shirazi
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引用次数: 5

摘要

目前的商用片上系统(SoC)设计集成了越来越多的预先设计的核心,预计其数量在不久的将来会显著增加。具体来说,分子尺度计算将允许单个甚至多个数量级的设备密度改进。在高性能大规模多核芯片的设计中,功耗和温度已经成为主要的制约因素。增加的功耗会提高芯片温度,从而降低芯片的可靠性和性能,并增加冷却成本。在单芯片集成方面,新的、随之而来的可能性需要新的范例、架构和基础设施来实现高带宽和低功耗互连。在本文中,我们展示了具有远程无线链路的小世界片上网络(NoC)架构如何能够设计节能和热效率高的可持续多核平台。
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Sustainable multi-core architecture with on-chip wireless links
Current commercial systems on chip (SoC) designs integrate an increasingly large number of pre-designed cores and their number is predicted to increase significantly in the near future. Specifically, molecular-scale computing will allow single or even multiple order-of-magnitude improvements in device densities. In the design of high-performance massive multi-core chips, power and temperature have become dominant constraints. Increased power consumption can raise chip temperature,which in turn can decrease chip reliability and performance and increase cooling costs.The new, ensuing possibilities in terms of single chip integration call for new paradigms, architectures, and infrastructures for high bandwidth and low-power interconnects. In this paper we demonstrate how small-world Network-on-Chip (NoC) architectures with long-range wireless links enable design of energy and thermally efficient sustainable multi-core platforms.
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