In-situ Optical Characterisation of Integrated Photonic Devices During Transfer Printing

Transfer printing enables back-end assembly of opto-electronic devices with the nanoscale accuracy necessary for waveguide device placement. Even with high positional control it is still common for critical devices to require rework due to small fabrication inconsistencies between devices. An optical module has been developed that allows active monitoring of devices during printing that enables consistent performance across printed components.