模拟复杂的孔洞结构

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967633

E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion

{"title":"模拟复杂的孔洞结构","authors":"E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion","doi":"10.1109/EPEP.2001.967633","DOIUrl":null,"url":null,"abstract":"We derive a physics based circuit model for complex via hole structures on PCBs. Capacitances are computed using a three-dimensional electrostatic solver and inductances using a two-dimensional quasi-TEM solver (Olyslager et al, IEEE Trans. Microwave Theory Tech., vol. 39, no. 6, pp. 901-909, 1991).","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":"{\"title\":\"Modelling complex via hole structures\",\"authors\":\"E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion\",\"doi\":\"10.1109/EPEP.2001.967633\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We derive a physics based circuit model for complex via hole structures on PCBs. Capacitances are computed using a three-dimensional electrostatic solver and inductances using a two-dimensional quasi-TEM solver (Olyslager et al, IEEE Trans. Microwave Theory Tech., vol. 39, no. 6, pp. 901-909, 1991).\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"55\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967633\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967633","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 55

摘要

我们推导了一个基于物理的pcb上复杂通孔结构的电路模型。电容使用三维静电求解器计算，电感使用二维准瞬变电磁法求解(Olyslager et al, IEEE Trans.)。微波理论技术，第39卷，第39期。6，第901-909页，1991年)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Modelling complex via hole structures

We derive a physics based circuit model for complex via hole structures on PCBs. Capacitances are computed using a three-dimensional electrostatic solver and inductances using a two-dimensional quasi-TEM solver (Olyslager et al, IEEE Trans. Microwave Theory Tech., vol. 39, no. 6, pp. 901-909, 1991).

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

自引率

0.00%

发文量