{"title":"高性能多芯片模块的热放置","authors":"Kai-Yuan Chao, D. F. Wong","doi":"10.1109/ICCD.1995.528813","DOIUrl":null,"url":null,"abstract":"A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.","PeriodicalId":281907,"journal":{"name":"Proceedings of ICCD '95 International Conference on Computer Design. VLSI in Computers and Processors","volume":"313 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":"{\"title\":\"Thermal placement for high-performance multichip modules\",\"authors\":\"Kai-Yuan Chao, D. F. Wong\",\"doi\":\"10.1109/ICCD.1995.528813\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.\",\"PeriodicalId\":281907,\"journal\":{\"name\":\"Proceedings of ICCD '95 International Conference on Computer Design. VLSI in Computers and Processors\",\"volume\":\"313 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"27\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of ICCD '95 International Conference on Computer Design. VLSI in Computers and Processors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.1995.528813\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of ICCD '95 International Conference on Computer Design. VLSI in Computers and Processors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.1995.528813","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal placement for high-performance multichip modules
A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.
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