制程后晶片功率特性的统计特性

Yufu Zhang, Ankur Srivastava
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引用次数: 2

摘要

功耗/温度限制是当今高性能处理器最重要的设计考虑因素之一。许多动态功率或热管理(DPM/DTM)技术已被提出,以保持可靠的芯片运行和满足功率限制。这些技术依赖于运行时估计方案,该方案可以在芯片运行期间报告准确的功率和温度状态。然而,许多这样的估计方案需要统计系统功率行为的先验知识来产生准确的结果。本文讨论了利用实际工作负载信息提取芯片后期统计功率特性的问题。我们首先将芯片的统计功率特性建模为多个高斯分布的混合。这些发行版中的每一个本质上都捕获类似应用程序集群的行为。然后,我们开发了一种期望最大化算法来学习这种混合高斯模型的参数。实验结果与使用SPEC基准模拟的芯片的实际功率特性进行了比较,结果显示在97%的精度范围内。我们还演示了使用我们的方法学习的统计模型如何在流行的卡尔曼滤波框架中用于准确的运行时温度估计。
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Statistical characterization of chip power behavior at post-fabrication stage
Power/temperature constraints are among the most important design considerations for today's high performance processors. Many dynamic power or thermal management (DPM/DTM) techniques have been proposed to maintain reliable chip operation and meet power constraints. These techniques rely on runtime estimation schemes that can report accurate power and temperature status of the chip during its operation. However many such estimation schemes require prior knowledge of the statistical system power behavior to generate accurate results. In this paper we discuss the problem of extracting the statistical power characteristics of a chip at post-fabrication stage using real workload information. We first model the statistical power characteristics of a chip as a mixture of multiple Gaussian distributions. Each of these distributions essentially captures the behavior of a cluster of similar applications. We then develop an Expectation-Maximization algorithm for learning the parameters of this mixture Gaussian model. The experimental results are compared against the actual power characteristics of the chip simulated using SPEC benchmarks and are shown to be within 97% accuracy range. We also demonstrate how the statistical model learned using our approach can be exploited in a popular Kalman filter framework for accurate runtime temperature estimation.
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