去耦电容的有效去耦半径

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967663

Huabo Chen, J. Fang, Weimin Shi

{"title":"去耦电容的有效去耦半径","authors":"Huabo Chen, J. Fang, Weimin Shi","doi":"10.1109/EPEP.2001.967663","DOIUrl":null,"url":null,"abstract":"Decoupling capacitors on packages and printed circuit boards are often essential to reduce voltage fluctuations and maintain power and signal integrity. This paper presents a measure for the evaluation of effectiveness of decoupling capacitors placed on package or board structures.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Effective decoupling radius of decoupling capacitor\",\"authors\":\"Huabo Chen, J. Fang, Weimin Shi\",\"doi\":\"10.1109/EPEP.2001.967663\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Decoupling capacitors on packages and printed circuit boards are often essential to reduce voltage fluctuations and maintain power and signal integrity. This paper presents a measure for the evaluation of effectiveness of decoupling capacitors placed on package or board structures.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"125 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967663\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967663","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 18

摘要

封装和印刷电路板上的去耦电容器通常对于减少电压波动和保持功率和信号完整性至关重要。本文提出了一种评估封装或板状结构上去耦电容器有效性的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effective decoupling radius of decoupling capacitor

Decoupling capacitors on packages and printed circuit boards are often essential to reduce voltage fluctuations and maintain power and signal integrity. This paper presents a measure for the evaluation of effectiveness of decoupling capacitors placed on package or board structures.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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