商用1.2 kv SiC MPS二极管在浪涌电流和雪崩事件下的可靠性研究

F. Salcedo, J. Forbes, S. Bayne, R. Singh
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引用次数: 0

摘要

随着WBG(宽带隙)器件如SiC(碳化硅)在商业应用中取代Si(硅)的前景,必须对浪涌电流和雪崩能量可靠性进行分析,以验证用SiC取代Si在长期可靠性方面的可行性。功率变换器和逆变器在达到稳定状态之前经常由于负载短路或瞬变而暴露于这些事件。功率半导体器件,如功率mosfet(金属氧化物半导体场效应晶体管)或二极管在这些功率开关应用中经历过流或过电压的持续时间很短,这是很常见的。如果浪涌电流的额定值不合理,可能会损坏设备。过电压持续时间过长导致雪崩击穿,最终导致设备灾难性故障。本文研究了商用SiC MPS二极管在1.2 kV反向电压和20 A连续正向电流下的浪涌电流和雪崩击穿能力。在双阳极共享阴极配置下,二极管的额定非重复浪涌电流为164 A,总雪崩能量为220 mJ。设计并开发了一个测试平台来测试商用WBG二极管在浪涌和雪崩事件中的可靠性。每个设备首先进行表征,暴露在测试条件下,然后再次进行表征以监测退化迹象。对测试期间和测试后收集的数据进行了分析,以确定商业应用中的可靠性。
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Investigation into the Reliability of Commercial 1.2-kV SiC MPS Diodes under Surge Current and Avalanche Events
With the prospect of WBG (wide-bandgap) devices such as SiC (silicon carbide) taking the forefront to replace Si (silicon) in commercial applications, analysis must be done on surge current and avalanche energy reliability to verify the viability of replacing Si with SiC in terms of long-term reliability. Power converters and inverters are often exposed to these events due to a load short circuit or transients before reaching steady-state. It is common for power semiconductor devices such as power MOSFETs (metal-oxide-semiconductor field-effect transistors) or diodes to experience a short duration of overcurrent or overvoltage in these power switching applications. The surge current can potentially damage devices if not properly rated. Extended duration of overvoltage leads to avalanche breakdown, ending in catastrophic failure of the device. This paper investigates the surge current and avalanche breakdown capabilities of commercial SiC MPS diodes rated for 1.2 kV reverse voltage and 20 A continuous forward current. The diodes are rated for 164 A of non-repetitive surge current and 220 mJ of total avalanche energy in the dual anode shared cathode configuration. A testbed is designed and developed to test the reliability of commercial WBG diodes in surge and avalanche events. Each device is initially characterized, exposed to testing conditions, and then characterized again to monitor signs of degradation. Analysis of the data collected during and after testing was conducted to determine the reliability in commercial applications.
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