一个马尔可夫,变化感知电路级老化模型

N. C. Laurenciu, S. Cotofana
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引用次数: 2

摘要

准确的年龄建模和快速、稳健的可靠性签署成为集成电路(ic)设计中针对先进工艺技术节点的强制性约束。本文提出了一个马尔可夫框架,通过考虑过程、环境和时间变化的共同影响来评估和预测集成电路寿命。通过允许性能边界随时间变化,从而包括残余和非残余变化,并施加马尔可夫进化,我们提出了一个可以更好地适应各种实际条件的模型,从而在设计时实现适当的保护带选择和有效的老化缓解/补偿技术。所提出的框架在不同的应力条件下,在工艺变化和老化效应下进行了验证。实验结果表明,所考虑的电路预测寿命终止(EOL)的近似误差均值小于10%,标准差小于15%。
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A Markovian, variation-aware circuit-level aging model
Accurate age modeling, and fast, yet robust reliability sign-off emerged as mandatory constraints in integrated circuits (ICs) design for advanced process technology nodes. This paper proposes a Markovian framework to asses and predict the IC lifetime by taking into account the joint effects of process, environmental, and temporal variations. By allowing the performance boundary to vary in time such that both remnant and non remnant variations are encompassed, and imposing a Markovian evolution, we propose a model that can be better fitted to various real conditions, thus enabling at design-time appropriate guardbands selection and effective aging mitigation/compensation techniques. The proposed framework has been validated for different stress conditions, under process variations and aging effects. Experimental results indicate an approximation error with mean value smaller than 10% and a standard deviation smaller than 15% for the considered circuit predicted end-of-life (EOL).
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