{"title":"电磁场分析与电路仿真相结合的PCB/MCM统一设计技术","authors":"Hideaki Kimura, Norihito Iyenaga","doi":"10.1109/DATE.1998.655984","DOIUrl":null,"url":null,"abstract":"This paper proposes the unified design technique which combines electromagnetic field analysis [FDTD technique] with circuit simulator [HSPICE]. The proposed technique can analyze the integrated circuits [ICs] multi-chip-module [MCM], and printed circuit board [PCB] design in high-efficiency and high-accuracy including the rounding noise throughout the substrate. Furthermore, this technique can not only analyze the small signal operation but also large signal operation.","PeriodicalId":179207,"journal":{"name":"Proceedings Design, Automation and Test in Europe","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A unified technique for PCB/MCM design by combining electromagnetic field analysis with circuit simulator\",\"authors\":\"Hideaki Kimura, Norihito Iyenaga\",\"doi\":\"10.1109/DATE.1998.655984\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper proposes the unified design technique which combines electromagnetic field analysis [FDTD technique] with circuit simulator [HSPICE]. The proposed technique can analyze the integrated circuits [ICs] multi-chip-module [MCM], and printed circuit board [PCB] design in high-efficiency and high-accuracy including the rounding noise throughout the substrate. Furthermore, this technique can not only analyze the small signal operation but also large signal operation.\",\"PeriodicalId\":179207,\"journal\":{\"name\":\"Proceedings Design, Automation and Test in Europe\",\"volume\":\"72 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-02-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings Design, Automation and Test in Europe\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DATE.1998.655984\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Design, Automation and Test in Europe","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DATE.1998.655984","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A unified technique for PCB/MCM design by combining electromagnetic field analysis with circuit simulator
This paper proposes the unified design technique which combines electromagnetic field analysis [FDTD technique] with circuit simulator [HSPICE]. The proposed technique can analyze the integrated circuits [ICs] multi-chip-module [MCM], and printed circuit board [PCB] design in high-efficiency and high-accuracy including the rounding noise throughout the substrate. Furthermore, this technique can not only analyze the small signal operation but also large signal operation.
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