Y. Mori, H. Yabuki, M. Ohba, M. Sagawa, M. Makimoto, I. Shibazaki
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Miniaturized RF-circuit modules for land mobile communication equipment
Compact RF circuit modules using multilayered printed circuit boards (M-PCBs) are described. The theoretical analysis of split-ring resonators and spiral inductors, fundamental RF circuits elements embedded in M-PCBs, is presented. RF circuit modules, such as a frequency synthesizer, a phase-locked loop modulator, an up-converter, and a receiver front-end are demonstrated to be applicable to land mobile communication equipment. RF circuit modules using M-PCBs have a structure suitable for excellent antivibration characteristics, and the size of the newly developed modules has been reduced to one-quarter of that of conventional modules designed by surface-mount technology.<>