{"title":"用于BGA封装测量的宽带Through-Line-Line去嵌入技术","authors":"H. Liang, J. Laskar, M. Hyslop","doi":"10.1109/EPEP.2001.967627","DOIUrl":null,"url":null,"abstract":"In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"267 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A broad band Through-Line-Line de-embedding technique for BGA package measurements\",\"authors\":\"H. Liang, J. Laskar, M. Hyslop\",\"doi\":\"10.1109/EPEP.2001.967627\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"267 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967627\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967627","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A broad band Through-Line-Line de-embedding technique for BGA package measurements
In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement.
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