{"title":"嵌入式系统弹性软件质量评估的仪器技术研究","authors":"David P. Y. Lawrence, Didier Buchs, A. Wellig","doi":"10.1007/978-3-319-12241-0_11","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":284001,"journal":{"name":"International Workshop on Software Engineering for Resilient Systems","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Using Instrumentation for Quality Assessment of Resilient Software in Embedded Systems\",\"authors\":\"David P. Y. Lawrence, Didier Buchs, A. Wellig\",\"doi\":\"10.1007/978-3-319-12241-0_11\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":284001,\"journal\":{\"name\":\"International Workshop on Software Engineering for Resilient Systems\",\"volume\":\"74 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Workshop on Software Engineering for Resilient Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/978-3-319-12241-0_11\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Workshop on Software Engineering for Resilient Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-319-12241-0_11","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}