Si(100)衬底上异质结构GaN/AlN的结构特性和表面粗糙度

A. S. Bakri, N. Nayan, A. Bakar, Z. Azman, N. A. Raship, Muliana Tahan, R. Ali
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引用次数: 1

摘要

许多人认为氮化镓已经证明了在电力电子器件和发光二极管中取代硅半导体的能力。本课题采用射频磁控溅射法制备了氮化镓/氮化铝的异质结构,并对其性能进行了研究。利用x射线衍射仪(XRD)和原子力显微镜(AFM)研究了沉积膜的结构和表面粗糙度。此外,采用场发射扫描电镜(FESEM)测量了GaN/AlN的厚度。XRD结果表明,沉积的氮化镓为非晶态,表面粗糙度和晶粒尺寸分别在$\sim 2$ nm和60 nm左右。原子力显微镜(AFM)表面形貌显示GaN/AlN膜具有均匀的结构,FESEM图像显示GaN/AlN膜具有卵石状结构。
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Structural properties and surface roughness of heterostructure GaN/AlN on Si (100) substrate
The GaN is considered by many as it has demonstrated the capability to be the displacement technology for silicon semiconductor in power electronic devices and light emitting diodes. In this project, heterostructure of GaN/AlN were deposited using RF magnetron sputtering at room temperature and its properties was studied. The structural and surface roughness of the deposited films were studied using X-ray diffraction (XRD) and atomic force microscope (AFM). Additionally, cross-sectional of field emission scanning electron microscope (FESEM) was used for the measurement of GaN/AlN thickness. The XRD results show that the deposited GaN is amorphous while the surface roughness and grain size are in the of $\sim 2$ nm and 60 nm, respectively. The surface topography observed using AFM shows that the GaN/AlN has homogenous structure while FESEM images show that the GaN/AlN film has pebble like structure.
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