滚动接触载荷下表面沟槽周围的光粘弹性应力和应变分析

S. Yoneyama, Daisuke Ayame, J. Gotoh, M. Takashi
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引用次数: 10

摘要

本文讨论了刚性移动滚子与粘弹性板(板的上边缘有深槽)接触表面附近局部小尺度断裂的基本机理,模拟了接触表面周围的点蚀或表面裂纹。采用光粘弹性方法研究了非比例加载条件下的随时应力应变状态,考虑了移动接触载荷与表面沟槽的应力场相互作用的典型情况。在表面凹槽尖端附近观察到复杂的随时间变化的光粘弹性条纹图案。在材料表现出明显粘弹性行为的温度下,利用方便的计算机辅助光粘弹性技术计算了主应力差和主应变差的时间变化,以及应力、应变和双折射的主方向。应力强度因子K I和K II的时间变化也根据Sanford和Dally提出的技术使用最小二乘法进行评估。
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Photoviscoelastic Stress and Strain Analysis around a Surface Groove under Rolling Contact Load
The authors discuss the first step in the approach to the fundamental mechanism of small-scale local fracture near the contact surface between a rigid traveling roller and a viscoelastic plate which has a deep groove on the upper edge of the plate, which simulates pitting or surface cracking around the contact surface. The photoviscoelastic method is applied to investigate the time-dependent stress and strain state under the condition of nonproportional loading, taking a typical case of the interaction of stress fields due to a traveling contact load and a surface groove into account. Complicated variations of the time-dependent photoviscoelastic fringe pattern are observed near the tip of the surface groove. The time variations of not only the principal stress difference and principal strain difference, but also principal directions of stress, strain and birefringence are evaluated using a convenient computer-aided photoviscoelastic technique under the temperature at which the material shows marked viscoelastic behavior. Time variations of stress intensity factors, K I and K II , are also evaluated using the least-squares method following the technique proposed by Sanford and Dally.
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