电子元件的材料选择- Zytel®高温尼龙HTN和Zentie®LCP

2006 2nd International Conference on Power Electronics Systems and Applications Pub Date : 2006-11-01 DOI:10.1109/PESA.2006.343064

Gregory Lau

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摘要

本文介绍了杜邦工程聚合物，并讨论了新的行业法规如何影响无铅(Pb-free)电子元件材料的选择。讨论的材料性能包括耐热性、可燃性等级、吸湿敏感性、介电性能、电绝缘等级、机械和加工以及环境需求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Material Selection of Electronic Components - Zytel® High Temperature Nylon HTN and Zentie® LCP

This paper present the DuPont Engineering Polymers and discuss how the new industry regulations impact lead free (Pb-free) electronic component material selection. The material properties discussed include thermal resistance, flammability rating, moisture absorption sensitivity, dielectric performance, electrical insulation rating, mechanical and processing and environmental needs.

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2006 2nd International Conference on Power Electronics Systems and Applications

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