综合分析和数值模拟系统级传导/辐射抗扰度分析

Xian-Ke Gao, H. Yik, Boon-Hui Lim, Huapeng Zhao, Binfang Wang, E. Li
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引用次数: 1

摘要

本文提出了一种结合解析法和数值法的系统级建模方法来分析电子系统的传导和辐射电磁抗扰度。利用半解析法提取电缆、PCBA(电路板、走线、过孔、连接器和元件)和外壳的固有行为特征,建立了一个能够模拟传导和/或辐射电磁干扰下的瞬态/交流响应和串扰的等效电路模型。开发了一个计算机辅助建模系统,以帮助工业工程师利用所提出的方法进行EMC设计。
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Integrated analytical and numerical modeling for system level conducted/radiated immunity analysis
This paper presents a system-level modeling method by integrating analytical and numerical methods to analyze conducted and radiated electromagnetic immunity of electronic systems. Through extracting the intrinsic behavioural characteristics from cables, PCBA (board, traces, vias, connectors and components) and enclosure by using the semi-analytical method, one equivalent circuit model is built which is capable of simulating the transient/AC responses and crosstalk under conducted and/or radiated electromagnetic interference. A computer aided modelling system is developed to help industry engineers utilize the proposed methodology for their EMC design.
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