{"title":"利用E-CAP解决高性能高频应用中的功率解耦问题","authors":"Mukund Krishna, Luca Vassalli","doi":"10.1109/mpel.2023.3301415","DOIUrl":null,"url":null,"abstract":"As one of the most basic and fundamental components in electronics, capacitors are used in large numbers across a variety of designs. A key requirement for applications such as mobile phones, IoT devices, and high-performance compute applications is to effectively address last mile power delivery challenges, such as high-frequency power demands for the high-performance processors that they are inevitably based on. While traditional multilayer ceramic capacitors (MLCCs) have fulfilled the requirements thus far, stricter constraints on power density are challenging the continued usage of the existing model.","PeriodicalId":13049,"journal":{"name":"IEEE Power Electronics Magazine","volume":"60 1","pages":"0"},"PeriodicalIF":2.6000,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Addressing Power Decoupling in High-Performance, High-Frequency Applications Using E-CAP\",\"authors\":\"Mukund Krishna, Luca Vassalli\",\"doi\":\"10.1109/mpel.2023.3301415\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As one of the most basic and fundamental components in electronics, capacitors are used in large numbers across a variety of designs. A key requirement for applications such as mobile phones, IoT devices, and high-performance compute applications is to effectively address last mile power delivery challenges, such as high-frequency power demands for the high-performance processors that they are inevitably based on. While traditional multilayer ceramic capacitors (MLCCs) have fulfilled the requirements thus far, stricter constraints on power density are challenging the continued usage of the existing model.\",\"PeriodicalId\":13049,\"journal\":{\"name\":\"IEEE Power Electronics Magazine\",\"volume\":\"60 1\",\"pages\":\"0\"},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2023-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Power Electronics Magazine\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/mpel.2023.3301415\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Power Electronics Magazine","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/mpel.2023.3301415","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Addressing Power Decoupling in High-Performance, High-Frequency Applications Using E-CAP
As one of the most basic and fundamental components in electronics, capacitors are used in large numbers across a variety of designs. A key requirement for applications such as mobile phones, IoT devices, and high-performance compute applications is to effectively address last mile power delivery challenges, such as high-frequency power demands for the high-performance processors that they are inevitably based on. While traditional multilayer ceramic capacitors (MLCCs) have fulfilled the requirements thus far, stricter constraints on power density are challenging the continued usage of the existing model.
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