铁电材料BaTiO3对负电容TFET器件的影响及其电路应用

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Integrated Ferroelectrics Pub Date : 2023-09-02 DOI:10.1080/10584587.2023.2227054
Amandeep Singh, Sanjeet Kumar Sinha, Sweta Chander
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引用次数: 0

摘要

随着纳米尺度下晶体管尺寸的增大,晶体管工作中出现了各种各样的短沟道效应,传统晶体管在实际应用中必须加以解决。为了克服短沟道效应,并在实际电路应用中用优化的器件取代传统的MOSFET,研究人员已经对器件进行了各种修改和结构改进。本文所提出的器件结构结合了负电容现象,使TFET的亚阈值摆幅更陡,提高了电流比。此外,还对器件尺寸进行了优化以获得临时特性,并在3nm厚的BaTiO3铁电材料上获得了最佳效果,用于制作负电容栅极堆。本文采用负电容TFET来实现逆变器和1t DRAM单元。结果表明,与传统电路相比,逆变器和DRAM单元工作在非常低的电源电压下,更适合于低功耗应用。
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Impact of Ferroelectric Material BaTiO3 on Negative Capacitance TFET Device and Its Circuit Application
With the increase in scaling of transistors in nanometer regime, various short channel effects are emerging in transistor operation that are required to resolved while putting conventional transistor to any practical application. Various device modifications and structure improvizations have been made and reported by the researchers to overcome the short channel effects and replace the conventional MOSFET with an optimized device in practical circuit applications. The device structure proposed in this work incorporates the negative capacitance phenomenon for making subthreshold swing steeper and enhancing current ratio of TFET. Further the device dimensions are being optimized to get improvised characteristics and best results are obtained at 3 nm thick BaTiO3 Ferroelectric material for making negative capacitance gate stack. In this paper, negative capacitance TFET so formed is used for implementing inverter and 1 T DRAM cell. Results obtained shows that the inverter and DRAM cell operates at a very lower supply voltage and are more suitable for low power applications as compared to conventional circuits.
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来源期刊
Integrated Ferroelectrics
Integrated Ferroelectrics 工程技术-工程:电子与电气
CiteScore
1.40
自引率
0.00%
发文量
179
审稿时长
3 months
期刊介绍: Integrated Ferroelectrics provides an international, interdisciplinary forum for electronic engineers and physicists as well as process and systems engineers, ceramicists, and chemists who are involved in research, design, development, manufacturing and utilization of integrated ferroelectric devices. Such devices unite ferroelectric films and semiconductor integrated circuit chips. The result is a new family of electronic devices, which combine the unique nonvolatile memory, pyroelectric, piezoelectric, photorefractive, radiation-hard, acoustic and/or dielectric properties of ferroelectric materials with the dynamic memory, logic and/or amplification properties and miniaturization and low-cost advantages of semiconductor i.c. technology.
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