Super cooling technology based on rotor-wing multi-order microchannel structure

In view of the increasingly serious heat dissipation problem caused by the development of electronic devices towards higher power and higher integration, a rotor-wing microchannel heat sink is designed in this paper. Based on the good shunt characteristics of the rotor-wing microchannel, the characteristic design of the multi-order microchannel is proposed, which expands the design idea of the radiation microchannel. Through this research, it is found that the convective heat transfer area, the fluid-solid duty cycle and the channel layout of the microchannel are synergistically coupled to enhance the cooling capacity, and the change of these three items cannot achieve a single change, which increases the coupling factor between the three. In order to take into account the cooling capacity and pressure drop of the heat sink, a further design of functional four outlets is proposed, which systematically improves the cooling capacity and reduces the pressure drop of the heat sink. The thermal resistance distribution ratio of different microchannel heat sinks is systematically analyzed by finite element simulation and theoretical method, which points out the direction for further improving the cooling capacity. The rotor-wing multi-order microchannel heat sink was fabricated by the micromachining process. Finally, the cooling capacity of different designs was verified by experimental tests and can reach 932.08 W/cm 2 , laying the foundation for replacing the traditional water-cooled plate cooling system.