基于时空非局域效应的广义热弹性理论的硅超短脉冲激光烧蚀模型

IF 2.6 3区 工程技术 Q2 MECHANICS Journal of Thermal Stresses Pub Date : 2023-11-01 DOI:10.1080/01495739.2023.2268141
Yan Li, Luke Zhao, Tianhu He, Xiaogeng Tian, Kai Liao
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引用次数: 0

摘要

摘要建立了具有时空非局域效应的超短脉冲激光烧蚀广义热弹性模型,研究了皮秒脉冲激光烧蚀硅过程的瞬态响应。研究分为三个案例。1)研究了目标表面熔化前的固体硅,将其最终状态的瞬态响应作为第二种情况的初始条件。2)研究了目标表面熔化后的液态硅,在边界条件中考虑了蒸发带走的热流密度。3)讨论了目标表面熔融后的固体硅,以移动的固液界面为坐标原点。建立了包含空间非局部参数、时滞因子和核函数的耦合控制方程,利用拉普拉斯变换及其数值反演进行求解。重点讨论了靶材的熔化时间和熔化深度。得到了不同激光强度下的温度、位移和应力、空间非局部参数、时间延迟因子、核函数和时间的变化规律,并给出了图形。关键词:烧蚀广义热弹性理论时空非局域效应超短脉冲激光加工汽化公开声明作者未报告潜在利益冲突。本研究由国家自然科学基金(11732007)资助。
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The ultrashort pulse laser ablation model of silicon based on the generalized thermoelastic theory with spatio-temporal nonlocal effect
AbstractThe present work is devoted to establishing the ultrashort pulse laser ablation generalized thermoelastic model with spatio-temporal nonlocal effect and investigating the transient responses of the process of silicon ablated by the picosecond pulse laser. The research is divided into three cases. 1) The solid silicon before the target surface melting is studied, and the transient responses of the final state of this case are taken as the initial conditions of the Case Two. 2) The liquid silicon after the target surface melting is researched, and the heat flux taken away by vaporization is considered in the boundary condition. 3) The solid silicon after the target surface melting is discussed, and the moving solid-liquid interface is regarded as the coordinate origin. The coupled governing equations containing spatial nonlocal parameter, time delay factor, and kernel function are established and solved by the Laplace transform together with its numerical inversion. The melting time and depth of target are emphatically discussed. The temperature, displacement and stress with different laser intensity, spatial nonlocal parameter, time delay factor, kernel function as well as time are obtained and illustrated graphically.Keywords: Ablationgeneralized thermoelastic theoryspatio-temporal nonlocal effectultrashort pulse laser processingvaporization Disclosure statementNo potential conflict of interest was reported by the author(s).Additional informationFundingThis research is supported by the National Natural Science Foundation of China (11732007).
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来源期刊
Journal of Thermal Stresses
Journal of Thermal Stresses 工程技术-力学
CiteScore
5.20
自引率
7.10%
发文量
58
审稿时长
3 months
期刊介绍: The first international journal devoted exclusively to the subject, Journal of Thermal Stresses publishes refereed articles on the theoretical and industrial applications of thermal stresses. Intended as a forum for those engaged in analytic as well as experimental research, this monthly journal includes papers on mathematical and practical applications. Emphasis is placed on new developments in thermoelasticity, thermoplasticity, and theory and applications of thermal stresses. Papers on experimental methods and on numerical methods, including finite element methods, are also published.
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