src主导的材料研究:40年前,现在

IF 0.8 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY MRS Advances Pub Date : 2023-11-03 DOI:10.1557/s43580-023-00665-4
Victor Zhirnov, Michelle E. Chen, Mohamadali Malakoutian, Hannah R. M. Margavio, Emma Pawliczak, Kate Reidy, Wilson Yanez, Todd Younkin
{"title":"src主导的材料研究:40年前,现在","authors":"Victor Zhirnov, Michelle E. Chen, Mohamadali Malakoutian, Hannah R. M. Margavio, Emma Pawliczak, Kate Reidy, Wilson Yanez, Todd Younkin","doi":"10.1557/s43580-023-00665-4","DOIUrl":null,"url":null,"abstract":"Today, we are living through a pivotal moment when the semiconductor industry is moving towards 3D-integration including the close integration of logic and memory, the tighter integration of mixed-signal circuits, spintronic, embedded memories, sensors, communications, and improved power management. It is expected that 3D monolithic and heterogeneous integration will result in a new, truly multi-functional platform that drives continued system progress in the coming decades. Thus, over the next 40 years, the semiconductor industry will require significant innovation. At the heart of that is the need for significant contributions from the materials ecosystem to drive materials from the laboratory to the factory. For this perspective article, a selected group of distinguished SRC Scholars have been invited to present their research in the context of the potential impact that their work will drive for the future of microelectronics.","PeriodicalId":19015,"journal":{"name":"MRS Advances","volume":"57 2","pages":"0"},"PeriodicalIF":0.8000,"publicationDate":"2023-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"SRC-led materials research: 40 years ago, and now\",\"authors\":\"Victor Zhirnov, Michelle E. Chen, Mohamadali Malakoutian, Hannah R. M. Margavio, Emma Pawliczak, Kate Reidy, Wilson Yanez, Todd Younkin\",\"doi\":\"10.1557/s43580-023-00665-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Today, we are living through a pivotal moment when the semiconductor industry is moving towards 3D-integration including the close integration of logic and memory, the tighter integration of mixed-signal circuits, spintronic, embedded memories, sensors, communications, and improved power management. It is expected that 3D monolithic and heterogeneous integration will result in a new, truly multi-functional platform that drives continued system progress in the coming decades. Thus, over the next 40 years, the semiconductor industry will require significant innovation. At the heart of that is the need for significant contributions from the materials ecosystem to drive materials from the laboratory to the factory. For this perspective article, a selected group of distinguished SRC Scholars have been invited to present their research in the context of the potential impact that their work will drive for the future of microelectronics.\",\"PeriodicalId\":19015,\"journal\":{\"name\":\"MRS Advances\",\"volume\":\"57 2\",\"pages\":\"0\"},\"PeriodicalIF\":0.8000,\"publicationDate\":\"2023-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"MRS Advances\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1557/s43580-023-00665-4\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"MRS Advances","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1557/s43580-023-00665-4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
SRC-led materials research: 40 years ago, and now
Today, we are living through a pivotal moment when the semiconductor industry is moving towards 3D-integration including the close integration of logic and memory, the tighter integration of mixed-signal circuits, spintronic, embedded memories, sensors, communications, and improved power management. It is expected that 3D monolithic and heterogeneous integration will result in a new, truly multi-functional platform that drives continued system progress in the coming decades. Thus, over the next 40 years, the semiconductor industry will require significant innovation. At the heart of that is the need for significant contributions from the materials ecosystem to drive materials from the laboratory to the factory. For this perspective article, a selected group of distinguished SRC Scholars have been invited to present their research in the context of the potential impact that their work will drive for the future of microelectronics.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
MRS Advances
MRS Advances MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
1.50
自引率
0.00%
发文量
184
期刊最新文献
Sorption behavior of cesium ions to Mg-containing calcium silicate hydrate in a co-precipitation process Pair potential description on phase stability variations in close-packed polytypism Saffron extract-mediated synthesis of Cu(OH)2 nanocomposite: Structural and photocatalytic activity investigation Detection of wells in images of deformed 96-wells plates A facile growth, optical behavior of organic nonlinear optical crystal: 4-bromo-2-methylbenzonitrile
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1