{"title":"界面张力在夹杂物热弹性分析中的作用:统一公式和封闭形式的结果","authors":"Ruifeng Zhang, Jie-Yao Tang, Jian Qiu, Ming Dai","doi":"10.1080/01495739.2023.2256813","DOIUrl":null,"url":null,"abstract":"AbstractWe study the thermoelastic problem of an inclusion of general shape surrounded by a foreign elastic matrix under plane deformation and the influence of an in-plane far-field heat flux. The small-scale interface effects, related to not only interface conductivity, interface stretching rigidity and interface thermal expansion but also (residual) interface tension, are incorporated in the corresponding analysis. We establish general boundary value formulations in both heat conduction and thermoelasticity for an arbitrary inclusion shape, allowing for analytic or at least semi-analytic treatment of the problem. Specially, we derive closed-form solutions for the case of circular inclusion and obtain concise expressions for describing the remote heat flux-induced thermal stress near the interface (at both the inclusion side and matrix side). Surprisingly, it is shown that for the case of circular inclusion, interface tension plays the same role as interface stretching rigidity in determining the full thermal stress field, or in other words, the full thermal stress field depends on only the sum of interface tension and interface stretching rigidity but not on the specific value of either of them. Numerical examples are also given to illustrate the influence of interface tension on the von Mises stress distribution in the vicinity of the interface.Keywords: Conductive interfaceheat fluxinterface elasticityinterface tensionthermal stress Disclosure statementNo potential conflict of interest was reported by the author(s).Additional informationFundingDai appreciates the support of the National Natural Science Foundation of China (No. 11902147), the Natural Science Foundation of Jiangsu Province (No. BK20190393) and the Research Fund of State Key Laboratory of Mechanics and Control of Mechanical Structures (Nanjing University of Aeronautics and Astronautics) (Grant No. MCMS-I-0222Y01).","PeriodicalId":54759,"journal":{"name":"Journal of Thermal Stresses","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2023-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Role of interface tension in the thermoelastic analysis of inclusions: Unified formulation and closed-form results\",\"authors\":\"Ruifeng Zhang, Jie-Yao Tang, Jian Qiu, Ming Dai\",\"doi\":\"10.1080/01495739.2023.2256813\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"AbstractWe study the thermoelastic problem of an inclusion of general shape surrounded by a foreign elastic matrix under plane deformation and the influence of an in-plane far-field heat flux. 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引用次数: 1
摘要
摘要研究了平面变形和面内远场热通量影响下一般形状包体被外弹性矩阵包围的热弹性问题。在相应的分析中纳入了小规模的界面效应,包括界面导电性、界面拉伸刚度和界面热膨胀,以及(残余)界面张力。我们建立了任意包体形状的热传导和热弹性的一般边值公式,允许对问题进行解析或至少半解析处理。特别地,我们导出了圆形夹杂情况下的封闭解,并得到了描述界面附近(夹杂侧和基体侧)远端热通量引起的热应力的简明表达式。令人惊讶的是,对于圆形夹杂物,界面张力与界面拉伸刚度在确定全热应力场方面起着相同的作用,换句话说,全热应力场仅取决于界面张力和界面拉伸刚度的总和,而不取决于两者的具体值。数值算例说明了界面张力对界面附近von Mises应力分布的影响。关键词:导电界面热通量界面弹性界面张力热应力披露声明作者未报告潜在利益冲突。感谢国家自然科学基金项目(No. 11902147)、江苏省自然科学基金项目(No. 11902147)的支持。BK20190393)和国家重点实验室的研究基金会的力学和控制机械结构(南京航空航天大学)(批准号反水雷舰- i - 0222 - y01)。
Role of interface tension in the thermoelastic analysis of inclusions: Unified formulation and closed-form results
AbstractWe study the thermoelastic problem of an inclusion of general shape surrounded by a foreign elastic matrix under plane deformation and the influence of an in-plane far-field heat flux. The small-scale interface effects, related to not only interface conductivity, interface stretching rigidity and interface thermal expansion but also (residual) interface tension, are incorporated in the corresponding analysis. We establish general boundary value formulations in both heat conduction and thermoelasticity for an arbitrary inclusion shape, allowing for analytic or at least semi-analytic treatment of the problem. Specially, we derive closed-form solutions for the case of circular inclusion and obtain concise expressions for describing the remote heat flux-induced thermal stress near the interface (at both the inclusion side and matrix side). Surprisingly, it is shown that for the case of circular inclusion, interface tension plays the same role as interface stretching rigidity in determining the full thermal stress field, or in other words, the full thermal stress field depends on only the sum of interface tension and interface stretching rigidity but not on the specific value of either of them. Numerical examples are also given to illustrate the influence of interface tension on the von Mises stress distribution in the vicinity of the interface.Keywords: Conductive interfaceheat fluxinterface elasticityinterface tensionthermal stress Disclosure statementNo potential conflict of interest was reported by the author(s).Additional informationFundingDai appreciates the support of the National Natural Science Foundation of China (No. 11902147), the Natural Science Foundation of Jiangsu Province (No. BK20190393) and the Research Fund of State Key Laboratory of Mechanics and Control of Mechanical Structures (Nanjing University of Aeronautics and Astronautics) (Grant No. MCMS-I-0222Y01).
期刊介绍:
The first international journal devoted exclusively to the subject, Journal of Thermal Stresses publishes refereed articles on the theoretical and industrial applications of thermal stresses. Intended as a forum for those engaged in analytic as well as experimental research, this monthly journal includes papers on mathematical and practical applications. Emphasis is placed on new developments in thermoelasticity, thermoplasticity, and theory and applications of thermal stresses. Papers on experimental methods and on numerical methods, including finite element methods, are also published.