[阳极电位对牙科合金中金属成分溶解影响的研究]。

Shika gakuho. Dental science reports Pub Date : 1989-11-01
H Kobayashi
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引用次数: 0

摘要

未标记:本研究旨在评估阳极电位对牙科合金中金属成分溶解的影响,并旨在作为牙科金属爆发(金属过敏)研究的辅助手段。在0.9% NaCl溶液中,用电化学方法对各种牙用合金施加阳极电位。然后用原子吸收分光光度法测定金属成分的溶出量。此外,还考虑了金属成分溶解与电化学特性(由电流密度-时间瞬态计算的阳极极化和电荷转移)之间的关系。结果:1。根据阳极极化谱测定的击穿电位与组分溶解显著增加的电位一致。2. 电流密度时间暂态能很好地指示合金的腐蚀倾向。电荷转移与金属组分溶解总量的相关性较好。3.1)在200 mV (vs SCE)以上的电位下,铜和锌在金合金(II型和IV型)中有轻微的溶解。2)在100 mV以上电位下,Ag-Pd-Cu- au合金中有Ag、Pd、Cu和Zn析出。较大量的锌在低电位下被释放。银和铜的溶解量分别在300 mV和500 mV时迅速增加。虽然在低电位下可以检测到微量的钯,但在500毫伏时,钯的溶解显著增加。3) Ag、In和Zn在0 mV以上电位下从Ag-In-Zn合金中析出。In和Zn的溶解量在20 mV以上增加。4)在-200 mV以上的电位下,Sn和Zn从Ag-Sn-Zn合金中溶解;当电位高于100mv时,银从同一合金中溶解。当电位高于100 mV时,Sn和Zn的溶解量增加。在-100 mV以上的电位下,Ni、Cu和Si从软型Ni-Cr合金(9.0 wt% Cr)中溶解。在高于0 mV的电位下,Cr、Mn和Fe从同一合金中溶解;和Co电位在200 mV以上。这种合金的金属成分溶解比本研究中使用的所有其他合金都要大。在0毫伏时释放了相当数量的Ni。(摘要删节为400字)
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[Study of the influence of the anodic potential on metal-components dissolution from dental alloys].

Unlabelled: This study aims to evaluate the influence of the anodic potential on metal-components dissolution from dental alloys and is intended to serve as an aid in the investigation of dental metal eruption (metal allergy). In the experiments, anodic potentials were applied electrochemically to various dental alloys in a 0.9% NaCl solution. Thereafter amounts of metal-component dissolution were measured by means of atomic absorption spectrophotometry. In addition, relations between metal-component dissolution and electrochemical characteristics (anodic polarization and charge transfer calculated from current density-time transients) were considered.

Results: 1. Breakdown potentials determined on the basis of anodic polarization profiles agreed with potentials of remarkable increase in component dissolution. 2. Current density-time transients gave good indications of alloys' corrosion tendencies. Correlations between charge transfer and total amounts of metal-component dissolution were comparatively good. 3. Metal-component dissolutions in various alloys at fixed anodic potentials 1) Cu and Zn were found to dissolve slightly from gold alloys (types II and IV) at potentials above 200 mV (vs SCE). 2) Ag, Pd, Cu, and Zn were found to dissolve from the Ag-Pd-Cu-Au alloy at potentials above 100 mV. A comparatively large amount of Zn was released at low potentials. Amounts of Ag and Cu dissolution increased rapidly at 300 mV and 500 mV respectively. Although traces of it were detectable at low potentials, dissolution of Pd increased remarkably at 500 mV. 3) Ag, In, and Zn were found to dissolve from the Ag-In-Zn alloy at potentials above O mV. Amounts of In and Zn dissolution increased above 20 mV. The increase was especially remarkable in the case of In. 4) Sn and Zn were found to dissolve from the Ag-Sn-Zn alloy at potentials above -200 mV; Ag dissolved from the same alloy at potentials above 100 mV. Amounts of Sn and Zn dissolution increased at potentials above 100 mV. This was especially true in the case of Sn. 5) Ni, Cu and Si were found to dissolve from the soft type Ni-Cr alloy (9.0 wt% Cr) at potentials above -100 mV. Cr, Mn, and Fe dissolved from the same alloy at potentials above 0 mV; and Co at potentials above 200 mV. Metal-component dissolution was greater in the case of this alloy than in those of all the other alloys used in this study. A considerable amount fo Ni was released at 0 mV.(ABSTRACT TRUNCATED AT 400 WORDS)

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