安全意识硬件的可测试性和可靠性设计》特刊简介

IF 2.2 4区 计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE ACM Transactions on Design Automation of Electronic Systems Pub Date : 2023-12-18 DOI:10.1145/3631476
Tianming Ni, Xiaoqing Wen, Hussam Amrouch, Cheng Zhuo, Peilin Song
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引用次数: 0

摘要

在学术界和工业界,关于安全意识硬件的可测试性和可靠性设计的研究都非常重要。随着全球化的不断发展,商业硬件的设计、制造、运输和供应现在涉及许多不同的国家,导致从硬件设计到制造的脆弱性加剧。第三方制造过程中植入的恶意硬件可能会控制电路的运行并篡改其功能,从而引发严重的安全问题。然而,硬件不仅包括设备和电路,还包括系统。一个重要的事实是,可测试性、可靠性和安全性技术来自不同的设计层,但影响评估是在系统层进行的。换句话说,不同层次的可测试性、可靠性和安全性设计可以整体进行,以实现整个系统的优化。此外,各设计层的可测试性、可靠性和安全性设计技术可以协同进行,以实现更好的性能。由于新架构和新技术带来的复杂性和机遇,可测试性、可靠性和安全性的权衡受到了学术界和工业界的关注,特别是在后摩尔时代。
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Introduction to the Special Issue on Design for Testability and Reliability of Security-aware Hardware

The research on design for testability and reliability of security-aware hardware has been important in both academia and industry. With ever-growing globalization, commercial hardware design, manufacturing, transportation, and supply now involve many different countries, resulting in aggravated vulnerability from hardware design to manufacturing. Hardware with malicious purposes implanted from the third-party manufacturing process may control the operation of a circuit and tamper its functions, causing serious security issues. However, hardware includes not only devices and circuits but also systems. An important fact is that testability, reliability, and security technologies come from different design layers, but the impact evaluation is conducted at the system level. In other words, the testability, reliability, and security design of different layers can be carried out in a holistic manner to achieve optimization for the whole system. In addition, the testability, reliability, and security design technologies of each design layer can be collaboratively conducted to achieve better performance. The testability, reliability, and security tradeoff has garnered attention from academia and industry, particularly in the Post-Moore Era, due to the complexities and opportunities arising from new architectures and technologies.

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来源期刊
ACM Transactions on Design Automation of Electronic Systems
ACM Transactions on Design Automation of Electronic Systems 工程技术-计算机:软件工程
CiteScore
3.20
自引率
7.10%
发文量
105
审稿时长
3 months
期刊介绍: TODAES is a premier ACM journal in design and automation of electronic systems. It publishes innovative work documenting significant research and development advances on the specification, design, analysis, simulation, testing, and evaluation of electronic systems, emphasizing a computer science/engineering orientation. Both theoretical analysis and practical solutions are welcome.
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