晶圆级合成二维集成电子材料

{"title":"晶圆级合成二维集成电子材料","authors":"Zijia Liu, Xunguo Gong, Jinran Cheng, Lei Shao, Chunshui Wang, Jian Jiang, Ruiqing Cheng, Jun He","doi":"10.1016/j.chip.2023.100080","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":501616,"journal":{"name":"Chip","volume":"39 19","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wafer-scale synthesis of two-dimensional materials for integrated electronics\",\"authors\":\"Zijia Liu, Xunguo Gong, Jinran Cheng, Lei Shao, Chunshui Wang, Jian Jiang, Ruiqing Cheng, Jun He\",\"doi\":\"10.1016/j.chip.2023.100080\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":501616,\"journal\":{\"name\":\"Chip\",\"volume\":\"39 19\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Chip\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1016/j.chip.2023.100080\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chip","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.chip.2023.100080","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}