{"title":"长距离垂直光栅耦合器耦合性能的计算研究","authors":"Zhonghua Yang, Wenbo Luo, Yu Sun","doi":"10.3390/photonics11010015","DOIUrl":null,"url":null,"abstract":"We present a high-efficiency silicon grating coupler design based on a left–right mirror-symmetric grating and a metal mirror. The coupler achieves nearly perfect 90-degree vertical coupling. When two SOI chips are placed face to face with a vertical working distance of 50 μm, the chip-to-chip interlayer coupling efficiency reaches as high as 96%. When the vertical working distance ranges from 45 μm to 55 μm, the coupling loss remains below 1 dB. We also verified the effectiveness of our designed vertical coupler through 3D FDTD full-model simulation. The results demonstrate that our proposed vertical coupling structure represents a high-efficiency solution for 3D optical interconnects. The integration of multiple photonic chips in a 3D package with vertical optical and electrical interconnects is also feasible in the foreseeable future.","PeriodicalId":20154,"journal":{"name":"Photonics","volume":"10 10","pages":""},"PeriodicalIF":2.1000,"publicationDate":"2023-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Computational Study of the Coupling Performances for a Long-Distance Vertical Grating Coupler\",\"authors\":\"Zhonghua Yang, Wenbo Luo, Yu Sun\",\"doi\":\"10.3390/photonics11010015\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a high-efficiency silicon grating coupler design based on a left–right mirror-symmetric grating and a metal mirror. The coupler achieves nearly perfect 90-degree vertical coupling. When two SOI chips are placed face to face with a vertical working distance of 50 μm, the chip-to-chip interlayer coupling efficiency reaches as high as 96%. When the vertical working distance ranges from 45 μm to 55 μm, the coupling loss remains below 1 dB. We also verified the effectiveness of our designed vertical coupler through 3D FDTD full-model simulation. The results demonstrate that our proposed vertical coupling structure represents a high-efficiency solution for 3D optical interconnects. The integration of multiple photonic chips in a 3D package with vertical optical and electrical interconnects is also feasible in the foreseeable future.\",\"PeriodicalId\":20154,\"journal\":{\"name\":\"Photonics\",\"volume\":\"10 10\",\"pages\":\"\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2023-12-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Photonics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.3390/photonics11010015\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Photonics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.3390/photonics11010015","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"OPTICS","Score":null,"Total":0}
引用次数: 0
摘要
我们介绍了一种基于左右镜面对称光栅和金属镜的高效硅光栅耦合器设计。该耦合器实现了近乎完美的 90 度垂直耦合。当两个 SOI 芯片面对面放置,垂直工作距离为 50 μm 时,芯片到芯片的层间耦合效率高达 96%。当垂直工作距离为 45 μm 至 55 μm 时,耦合损耗保持在 1 dB 以下。我们还通过三维 FDTD 全模型仿真验证了所设计的垂直耦合器的有效性。结果表明,我们提出的垂直耦合结构是三维光互连的高效解决方案。在可预见的未来,将多个光子芯片集成到带有垂直光电互连的三维封装中也是可行的。
Computational Study of the Coupling Performances for a Long-Distance Vertical Grating Coupler
We present a high-efficiency silicon grating coupler design based on a left–right mirror-symmetric grating and a metal mirror. The coupler achieves nearly perfect 90-degree vertical coupling. When two SOI chips are placed face to face with a vertical working distance of 50 μm, the chip-to-chip interlayer coupling efficiency reaches as high as 96%. When the vertical working distance ranges from 45 μm to 55 μm, the coupling loss remains below 1 dB. We also verified the effectiveness of our designed vertical coupler through 3D FDTD full-model simulation. The results demonstrate that our proposed vertical coupling structure represents a high-efficiency solution for 3D optical interconnects. The integration of multiple photonic chips in a 3D package with vertical optical and electrical interconnects is also feasible in the foreseeable future.
期刊介绍:
Photonics (ISSN 2304-6732) aims at a fast turn around time for peer-reviewing manuscripts and producing accepted articles. The online-only and open access nature of the journal will allow for a speedy and wide circulation of your research as well as review articles. We aim at establishing Photonics as a leading venue for publishing high impact fundamental research but also applications of optics and photonics. The journal particularly welcomes both theoretical (simulation) and experimental research. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. There is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Electronic files and software regarding the full details of the calculation and experimental procedure, if unable to be published in a normal way, can be deposited as supplementary material.