带氮化硅微孔的高功率窄线宽半导体激光器

Xin Zhang, Yilu Wu, Qingsong Bai, Yuqi Hu, Wei Xiong, Zhengmao Wu, Dan Lu, Jiagui Wu, Guangqiong Xia
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摘要

基于高功率 InGAsP 分布式反馈 (DFB) 半导体激光器与超高 Q 值氮化硅微孔的耦合,我们提出了一种实现高功率和窄线宽的混合集成半导体激光器方案。在这种方案中,高功率 DFB 激光器作为光源,其输出通过硅透镜有效耦合到超高 Q 值氮化硅微孔的输入波导端口。在不均匀氮化硅微孔中的瑞利散射提供的光反馈作用下,激光器可被驱动进入自注入锁定状态,在这种状态下,激光线宽可明显缩小。实验结果表明,采用这种混合集成方案,可以将激光的线宽缩小到 10 kHz,同时输出功率保持在 20 mW 的水平。混合集成半导体激光器在一些同时要求高相干性和高功率的领域具有应用前景,如激光雷达和远距离相干通信。
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High-power and narrow-linewidth semiconductor laser with silicon nitride microring
Based on a high power InGAsP distributed feedback (DFB) semiconductor laser coupling with an ultra-high-Q silicon nitride microring, we proposed a hybrid integration semiconductor laser scheme for realizing high power and narrow linewidth. For such a scheme, the high power DFB laser serves as the light source, whose output is efficiently coupled into the input waveguide port of ultra-high-Q silicon nitride microring through a silicon lens. Under the optical feedback provided by the Rayleigh scattering in the inhomogeneity silicon nitride microring, the laser may be driven into the self-injected locking state, under which the lasing linewidth can be obviously narrowed. The experimental results demonstrate that, adopting such a hybrid integration scheme, the lasing linewidth can be narrowed to 10 kHz and meanwhile the output power is maintained at the level of 20 mW. The hybrid integration semiconductor lasers have application prospects in some fields simultaneously requiring high coherence and high power, such as LiDAR and long-distance coherence communication.
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