L. Logunov, Ildar Yusupov, Dmitriy Shestakov, Andrey Shishov, Ilya Tumkin
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引用次数: 0
摘要
深共晶溶液激光辅助金属化是一种利用皮秒激光辐射从深共晶溶液薄膜中局部沉积金属(铜、镍、银......)的方法。因此,几乎可以在任何电介质表面制造金属或氧化物结构,而无需模板。这种方法可以在曲面上创建高分辨率的导电结构。本文展示了在玻璃表面用铜制作电子元件的过程。我们以 18 毫米/秒的最大沉积速度制作了 RFID 标签和其他器件,以展示该方法的优势。结果表明了该方法的优势,而且前驱体成本低廉、方法简单、环境友好,使其在工业领域的进一步应用具有吸引力。
High speed laser-assisted copper microstructures synthesis from deep eutectic solutions
Laser assisted metallization from deep eutectic solutions is a method that allows metal (Cu, Ni, Ag..) to be deposited locally from a film of deep eutectic solution using picosecond laser radiation. As a result, it is possible to create metals or oxides structures on the surface of almost any dielectric without template. The method allows creating conductive structures on curved surfaces with high resolution. This paper shows the creation of electronic components from copper on the surface of glass. We created RFID tag and other devices with a maximum deposition rate of 18mm/sec to show the opportunities of the method. The results demonstrate the advantages of the method, and the low cost of precursors, the simplicity of the method, and its environmental friendliness make it attractive for further implementation in the industry.