通过氧化化学气相沉积和温和等离子处理增强未取代聚噻吩的掺杂和结构松弛性

Yuxuan Zhang, Mingyuan Liu, Hyo-Young Yeom, Byung-Hyuk Jun, Jinwook Baek, Kwangsoo No, H. Song, Sunghwan Lee
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引用次数: 0

摘要

我们报告了通过氧化化学气相沉积(oCVD)和温和等离子体处理增强未取代聚噻吩(PT)电学特性的情况。处理后,p 型 oCVD PT 的功函数增加,表明费米级向价带边缘移动,载流子密度增加。此外,无论初始值如何,所有经等离子体处理的 oCVD PT 薄膜的功函数都几乎相同,高达 ~5.25 eV,这表明经等离子体处理的 oCVD PT 达到了伪平衡态。等离子处理后载流子密度的增加归因于最初未被激活的掺杂物种(即带中性电荷的 Br)被激活,这类似于被截留的电荷载流子被释放到 oCVD PT 的价带。oCVD PT 电性能的提高直接关系到薄膜晶体管性能的改善,如漏极电流开/关比(~103)和场效应迁移率(2.25 x 10-2 cm2/Vs),而未经处理的对应值分别为 102 和 0.09 x 10-2 cm/Vs。
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Enhanced doping and structure relaxation of unsubstituted polythiophene through oxidative chemical vapor deposition and mild plasma treatment
We report on the enhancement of electrical properties of unsubstituted polythiophene (PT) through oxidative chemical vapor deposition (oCVD) and mild plasma treatment. The work function of p-type oCVD PT increases after the treatment, indicating the Fermi level shift toward the valence band edge and an increase in carrier density. In addition, regardless of initial values, nearly the same work function is obtained for all the plasma-treated oCVD PT films as high as ~5.25 eV, suggesting the pseudo-equilibrium state is reached in the oCVD PT from the plasma treatment. This increase in carrier density after plasma treatment is attributed to the activation of initially not-activated dopant species (i.e., neutrally charged Br), which is analogous to the release of trapped charge carriers to the valence band of the oCVD PT. The enhancement of electrical properties of oCVD PT is directly related to the improvement of the thin film transistor performance such as drain current on/off ratio, ~103 and field effect mobility, 2.25 x 10-2 cm2/Vs, compared to untreated counterparts of 102 and 0.09 x 10-2 cm/Vs, respectively.
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