Eko Setio Wibowo, Byung-Dae Park, Jure Žigon, Milan Šernek
{"title":"不同分子量甲醛基树脂的热固化行为与粘接强度发展之间的关系","authors":"Eko Setio Wibowo, Byung-Dae Park, Jure Žigon, Milan Šernek","doi":"10.1080/01694243.2024.2314369","DOIUrl":null,"url":null,"abstract":"Urea–formaldehyde (UF) and phenol–formaldehyde (PF) resins are the most widely used adhesives in the production of wood composites, and are cured through hot-pressing to provide adhesion strength w...","PeriodicalId":14789,"journal":{"name":"Journal of Adhesion Science and Technology","volume":"23 1","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Relationship between thermal curing behavior and bond strength development in formaldehyde-based resins with different molecular weights\",\"authors\":\"Eko Setio Wibowo, Byung-Dae Park, Jure Žigon, Milan Šernek\",\"doi\":\"10.1080/01694243.2024.2314369\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Urea–formaldehyde (UF) and phenol–formaldehyde (PF) resins are the most widely used adhesives in the production of wood composites, and are cured through hot-pressing to provide adhesion strength w...\",\"PeriodicalId\":14789,\"journal\":{\"name\":\"Journal of Adhesion Science and Technology\",\"volume\":\"23 1\",\"pages\":\"\"},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2024-02-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Adhesion Science and Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/01694243.2024.2314369\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Adhesion Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/01694243.2024.2314369","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
Relationship between thermal curing behavior and bond strength development in formaldehyde-based resins with different molecular weights
Urea–formaldehyde (UF) and phenol–formaldehyde (PF) resins are the most widely used adhesives in the production of wood composites, and are cured through hot-pressing to provide adhesion strength w...
期刊介绍：
Journal of Adhesion Science and Technology ( JAST) provides a forum for the basic and applied aspects of adhesion, chemistry of adhesives, coatings and sealants, and structure-properties relationships in adhesive joints and deals with applications of adhesion principles in all areas of technology.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
