{"title":"通过匹配界面模量提高球形氮化硼/硅橡胶复合材料的热导率","authors":"Yu Fang, Jian Xie, Shiyu Qin, Xuhua Wang, Jie Yang, Shan Wang, Chuanxi Xiong","doi":"10.1080/09276440.2024.2320482","DOIUrl":null,"url":null,"abstract":"Lightweight, electrically insulating and high thermally conductive materials are highly desirable in electronic and power systems because they can effectively transfer heat and avoid temperature ri...","PeriodicalId":10653,"journal":{"name":"Composite Interfaces","volume":"11 1","pages":""},"PeriodicalIF":2.1000,"publicationDate":"2024-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhancing thermal conductivity of spherical boron nitride/silicone rubber composites by matching interfacial modulus\",\"authors\":\"Yu Fang, Jian Xie, Shiyu Qin, Xuhua Wang, Jie Yang, Shan Wang, Chuanxi Xiong\",\"doi\":\"10.1080/09276440.2024.2320482\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Lightweight, electrically insulating and high thermally conductive materials are highly desirable in electronic and power systems because they can effectively transfer heat and avoid temperature ri...\",\"PeriodicalId\":10653,\"journal\":{\"name\":\"Composite Interfaces\",\"volume\":\"11 1\",\"pages\":\"\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2024-02-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Composite Interfaces\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/09276440.2024.2320482\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, COMPOSITES\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composite Interfaces","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/09276440.2024.2320482","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
Enhancing thermal conductivity of spherical boron nitride/silicone rubber composites by matching interfacial modulus
Lightweight, electrically insulating and high thermally conductive materials are highly desirable in electronic and power systems because they can effectively transfer heat and avoid temperature ri...
期刊介绍：
Composite Interfaces publishes interdisciplinary scientific and engineering research articles on composite interfaces/interphases and their related phenomena. Presenting new concepts for the fundamental understanding of composite interface study, the journal balances interest in chemistry, physical properties, mechanical properties, molecular structures, characterization techniques and theories.
Composite Interfaces covers a wide range of topics including - but not restricted to:
-surface treatment of reinforcing fibers and fillers-
effect of interface structure on mechanical properties, physical properties, curing and rheology-
coupling agents-
synthesis of matrices designed to promote adhesion-
molecular and atomic characterization of interfaces-
interfacial morphology-
dynamic mechanical study of interphases-
interfacial compatibilization-
adsorption-
tribology-
composites with organic, inorganic and metallic materials-
composites applied to aerospace, automotive, appliances, electronics, construction, marine, optical and biomedical fields
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