{"title":"青年专业人员","authors":"Daniel Háže","doi":"10.1109/MEI.2024.10444767","DOIUrl":null,"url":null,"abstract":"It was early September 2023 when I received an email from the 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) organizers telling me I had been nominated for the Best Student Paper Award. Little did I know then what an experience it would be for me a month later in the USA.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 2","pages":"52-53"},"PeriodicalIF":2.6000,"publicationDate":"2024-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10444767","citationCount":"0","resultStr":"{\"title\":\"Young Professionals\",\"authors\":\"Daniel Háže\",\"doi\":\"10.1109/MEI.2024.10444767\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It was early September 2023 when I received an email from the 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) organizers telling me I had been nominated for the Best Student Paper Award. Little did I know then what an experience it would be for me a month later in the USA.\",\"PeriodicalId\":444,\"journal\":{\"name\":\"IEEE Electrical Insulation Magazine\",\"volume\":\"40 2\",\"pages\":\"52-53\"},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2024-02-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10444767\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electrical Insulation Magazine\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10444767/\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electrical Insulation Magazine","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10444767/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
It was early September 2023 when I received an email from the 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) organizers telling me I had been nominated for the Best Student Paper Award. Little did I know then what an experience it would be for me a month later in the USA.
期刊介绍：
The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
