{"title":"使用带或不带波浪形通道的不同类型空腔设计微通道散热器以提高热性能","authors":"Deepak Kumar Raj, Aparesh Datta, Nitin Kumar Soni","doi":"10.1080/01457632.2024.2317605","DOIUrl":null,"url":null,"abstract":"The development of innovative micro sinks design stems from the urge to perform efficient cooling at a cost of low pressure drop for more miniaturized electronic equipment. The three-dimensional in...","PeriodicalId":12979,"journal":{"name":"Heat Transfer Engineering","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of the Microchannels Heat Sink to Augment the Thermal Performance Using Different Type of Cavity with or without Wavy Channel\",\"authors\":\"Deepak Kumar Raj, Aparesh Datta, Nitin Kumar Soni\",\"doi\":\"10.1080/01457632.2024.2317605\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The development of innovative micro sinks design stems from the urge to perform efficient cooling at a cost of low pressure drop for more miniaturized electronic equipment. The three-dimensional in...\",\"PeriodicalId\":12979,\"journal\":{\"name\":\"Heat Transfer Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-02-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Heat Transfer Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1080/01457632.2024.2317605\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Heat Transfer Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/01457632.2024.2317605","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Design of the Microchannels Heat Sink to Augment the Thermal Performance Using Different Type of Cavity with or without Wavy Channel
The development of innovative micro sinks design stems from the urge to perform efficient cooling at a cost of low pressure drop for more miniaturized electronic equipment. The three-dimensional in...
期刊介绍：
Publishing 18 issues per year, Heat Transfer Engineering is an unparalleled resource for key advances in the field of heat transfer for the practicing engineer and other workers in the field. The journal publishes analytical, numerical, and experimental articles of lasting interest in the general area of heat-mass transfer and the related fluid mechanics and thermodynamics.
In a clear, easy-to-read format, the journal includes refereed papers of original work, state-of-the-art reviews, articles on new developments in equipment or practices, reviews of fundamentals, heat in history articles, book reviews, news items on people and companies in the field, advertising, and any other items that may be appropriate.
All submitted manuscripts are subject to initial appraisal by the Editor and/or selected members of the Editorial Board, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
