{"title":"用于电子设备热管理的液态金属相变材料","authors":"Yuchen Yao, Wei Li, Jing Liu, Zhongshan Deng","doi":"10.1080/23746149.2024.2324910","DOIUrl":null,"url":null,"abstract":"With the rapid development of various chips towards high performance and integration, the ‘thermal barrier’ difficulty facing electronic devices has become ever increasingly challenging, while at t...","PeriodicalId":7374,"journal":{"name":"Advances in Physics: X","volume":"5 1","pages":""},"PeriodicalIF":7.7000,"publicationDate":"2024-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Liquid metal phase change materials for thermal management of electronics\",\"authors\":\"Yuchen Yao, Wei Li, Jing Liu, Zhongshan Deng\",\"doi\":\"10.1080/23746149.2024.2324910\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the rapid development of various chips towards high performance and integration, the ‘thermal barrier’ difficulty facing electronic devices has become ever increasingly challenging, while at t...\",\"PeriodicalId\":7374,\"journal\":{\"name\":\"Advances in Physics: X\",\"volume\":\"5 1\",\"pages\":\"\"},\"PeriodicalIF\":7.7000,\"publicationDate\":\"2024-03-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advances in Physics: X\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.1080/23746149.2024.2324910\",\"RegionNum\":2,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"PHYSICS, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Physics: X","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1080/23746149.2024.2324910","RegionNum":2,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"PHYSICS, MULTIDISCIPLINARY","Score":null,"Total":0}
Liquid metal phase change materials for thermal management of electronics
With the rapid development of various chips towards high performance and integration, the ‘thermal barrier’ difficulty facing electronic devices has become ever increasingly challenging, while at t...
期刊介绍：
Advances in Physics: X is a fully open-access journal that promotes the centrality of physics and physical measurement to modern science and technology. Advances in Physics: X aims to demonstrate the interconnectivity of physics, meaning the intellectual relationships that exist between one branch of physics and another, as well as the influence of physics across (hence the “X”) traditional boundaries into other disciplines including:
Chemistry
Materials Science
Engineering
Biology
Medicine
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