Yu-Xiang Wang, C. Hung, Hans Pommerenke, Sung-Heng Wu, Tsai-Yun Liu
{"title":"使用激光箔印刷工艺制作无裂纹铝合金 6061 零件","authors":"Yu-Xiang Wang, C. Hung, Hans Pommerenke, Sung-Heng Wu, Tsai-Yun Liu","doi":"10.1108/rpj-10-2023-0370","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process. The process window of AA6061 in LFP was established to optimize process parameters for the fabrication of high strength, dense and crack-free parts even though AA6061 is challenging for laser additive manufacturing processes due to hot-cracking issues.\n\n\nDesign/methodology/approach\nThe multilayers AA6061 parts were fabricated by LFP to characterize for cracks and porosity. Mechanical properties of the LFP-fabricated AA6061 parts were tested using Vicker’s microhardness and tensile testes. The electron backscattered diffraction (EBSD) technique was used to reveal the grain structure and preferred orientation of AA6061 parts.\n\n\nFindings\nThe crack-free AA6061 parts with a high relative density of 99.8% were successfully fabricated using the optimal process parameters in LFP. The LFP-fabricated parts exhibited exceptional tensile strength and comparable ductility compared to AA6061 samples fabricated by conventional laser powder bed fusion (LPBF) processes. The EBSD result shows the formation of cracks was correlated with the cooling rate of the melt pool as cracks tended to develop within finer grain structures, which were formed in a shorter solidification time and higher cooling rate.\n\n\nOriginality/value\nThis study presents the pioneering achievement of fabricating crack-free AA6061 parts using LFP without the necessity of preheating the substrate or mixing nanoparticles into the melt pool during the laser melting. The study includes a comprehensive examination of both the mechanical properties and grain structures, with comparisons made to parts produced through the traditional LPBF method.\n","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"24 11","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of crack-free aluminum alloy 6061 parts using laser foil printing process\",\"authors\":\"Yu-Xiang Wang, C. Hung, Hans Pommerenke, Sung-Heng Wu, Tsai-Yun Liu\",\"doi\":\"10.1108/rpj-10-2023-0370\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nThis paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process. The process window of AA6061 in LFP was established to optimize process parameters for the fabrication of high strength, dense and crack-free parts even though AA6061 is challenging for laser additive manufacturing processes due to hot-cracking issues.\\n\\n\\nDesign/methodology/approach\\nThe multilayers AA6061 parts were fabricated by LFP to characterize for cracks and porosity. Mechanical properties of the LFP-fabricated AA6061 parts were tested using Vicker’s microhardness and tensile testes. The electron backscattered diffraction (EBSD) technique was used to reveal the grain structure and preferred orientation of AA6061 parts.\\n\\n\\nFindings\\nThe crack-free AA6061 parts with a high relative density of 99.8% were successfully fabricated using the optimal process parameters in LFP. The LFP-fabricated parts exhibited exceptional tensile strength and comparable ductility compared to AA6061 samples fabricated by conventional laser powder bed fusion (LPBF) processes. The EBSD result shows the formation of cracks was correlated with the cooling rate of the melt pool as cracks tended to develop within finer grain structures, which were formed in a shorter solidification time and higher cooling rate.\\n\\n\\nOriginality/value\\nThis study presents the pioneering achievement of fabricating crack-free AA6061 parts using LFP without the necessity of preheating the substrate or mixing nanoparticles into the melt pool during the laser melting. The study includes a comprehensive examination of both the mechanical properties and grain structures, with comparisons made to parts produced through the traditional LPBF method.\\n\",\"PeriodicalId\":3,\"journal\":{\"name\":\"ACS Applied Electronic Materials\",\"volume\":\"24 11\",\"pages\":\"\"},\"PeriodicalIF\":4.7000,\"publicationDate\":\"2024-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Electronic Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/rpj-10-2023-0370\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/rpj-10-2023-0370","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Fabrication of crack-free aluminum alloy 6061 parts using laser foil printing process
Purpose
This paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process. The process window of AA6061 in LFP was established to optimize process parameters for the fabrication of high strength, dense and crack-free parts even though AA6061 is challenging for laser additive manufacturing processes due to hot-cracking issues.
Design/methodology/approach
The multilayers AA6061 parts were fabricated by LFP to characterize for cracks and porosity. Mechanical properties of the LFP-fabricated AA6061 parts were tested using Vicker’s microhardness and tensile testes. The electron backscattered diffraction (EBSD) technique was used to reveal the grain structure and preferred orientation of AA6061 parts.
Findings
The crack-free AA6061 parts with a high relative density of 99.8% were successfully fabricated using the optimal process parameters in LFP. The LFP-fabricated parts exhibited exceptional tensile strength and comparable ductility compared to AA6061 samples fabricated by conventional laser powder bed fusion (LPBF) processes. The EBSD result shows the formation of cracks was correlated with the cooling rate of the melt pool as cracks tended to develop within finer grain structures, which were formed in a shorter solidification time and higher cooling rate.
Originality/value
This study presents the pioneering achievement of fabricating crack-free AA6061 parts using LFP without the necessity of preheating the substrate or mixing nanoparticles into the melt pool during the laser melting. The study includes a comprehensive examination of both the mechanical properties and grain structures, with comparisons made to parts produced through the traditional LPBF method.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
Scopus
CAS
INSPEC
Portico