Atomic-scale oxygen-vacancy engineering in Sub-2 nm thin Al2O3/MgO memristors

Ultrathin (sub-2 nm) Al2O3/MgO memristors were recently developed using an in vacuo atomic layer deposition (ALD) process that minimizes unintended defects and prevents undesirable leakage current. These memristors provide a unique platform that allows oxygen vacancies (VO) to be inserted into the memristor with atomic precision and study how this affects the formation and rupture of conductive filaments (CFs) during memristive switching. Herein, we present a systematic study on three sets of ultrathin Al2O3/MgO atomic layer stack (ALS) memristors with VO-doping via modular MgO atomic layer insertion into an otherwise pristine insulating Al2O3 ALS using an in vacuo ALD. At a fixed memristor thickness of 17 Al2O3/MgO atomic layers (~1.9 nm), the properties of the memristors were found to be affected by the number and stacking pattern of the MgO atomic layers in the Al2O3/MgO ALS. Importantly, the trend of reduced low-state resistance and the increasing appearance of multi-step switches with an increasing number of MgO atomic layers suggests a direct correlation between the dimension and dynamic evolution of the conducting filaments and the VO concentration and distribution. Understanding such a correlation is critical to an atomic–scale control of the switching behavior of ultrathin memristors.