关于为高频 PCB 线路设计具有缺陷微带结构的阶跃混合信号传输线

Y. V.
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摘要

本文探讨了印刷电路板上相邻路径串音所带来的挑战,强调了随着电子电路在速度和频率方面的进步,串音的重要性日益增加。提出的解决方案包括在阶梯形耦合传输线上引入新型 W 形缺陷微带结构 (DMS),利用混合信号输入缓解近端串扰 (NEXT) 和远端串扰 (FEXT)。一种在阶梯形耦合传输线上蚀刻的新型 W 形缺陷微带结构(DMS)。所提出的技术侧重于最小化电磁耦合强度,最小间距为微带宽度的一倍。它优化了耦合微带传输线之间的电容耦合和电感耦合比例,以改善串扰。利用计算机仿真技术(CST)进行的频域仿真显示了良好的结果。在 0 至 10 GHz 的频率范围内,所建议结构的插入损耗 (|S21|)、近端串扰 (|S31|)和远端串扰 (|S41|)分别为 1.425dB、<25dB 和 <25dB。眼图特性分析和测量结果显示,眼高、眼宽、抖动和数据速率分别为 0.942V、695.5ps、6.69ps 和 1.4Gbps。
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On the Design of a Stepped Mixed Signal Transmission Line with Defected Microstrip Structure for High-Frequency PCB Traces
The paper addresses the challenge of crosstalk in neighboring paths on PCBs, emphasizing its growing importance with the advancement of electronic circuits in terms of speed and frequency. The proposed solution involves the introduction of a novel W-shaped Defected Microstrip Structure (DMS) on a step-shaped coupled transmission lines to mitigate near-end crosstalk (NEXT) and far-end crosstalk (FEXT) using mixed signal input. A novel W-shaped defective microstrip structure (DMS) that is etched on step-shaped coupled transmission lines. The proposed technique focuses on minimizing the electromagnetic coupling strength with a minimum spacing of one time the width of the trace. It optimizes the ratio of capacitive coupling and inductive coupling between the coupled microstrip transmission lines to improve crosstalk. The frequency domain simulation, conducted using Computer Simulation Technology (CST), indicates promising results. The insertion loss (|S21|), near-end crosstalk (|S31|), and far-end crosstalk (|S41|) of the suggested structure are reported as 1.425dB, <25dB, and <25dB, respectively, over the frequency range of 0 to 10 GHz. Eye diagram characterizations are done and measured in terms of eye height, eye width, jitter and data rate are reported as 0.942V, 695.5ps, 6.69ps and 1.4Gbps respectively.
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