{"title":"通过化学反应在玻璃基板上制备低电阻和粘性金属铜层","authors":"M. Izaki, Yui Hashimoto, kosuke Imahori, Rieru Inaba, Khoo Pei Loon, Hisaya Takahashi","doi":"10.4139/sfj.75.40","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":17564,"journal":{"name":"Journal of The Surface Finishing Society of Japan","volume":"7 3","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Preparation of Low-resistive and Adhesive Metallic Cu layer on Glass Substrate by Chemical Reactions\",\"authors\":\"M. Izaki, Yui Hashimoto, kosuke Imahori, Rieru Inaba, Khoo Pei Loon, Hisaya Takahashi\",\"doi\":\"10.4139/sfj.75.40\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":17564,\"journal\":{\"name\":\"Journal of The Surface Finishing Society of Japan\",\"volume\":\"7 3\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of The Surface Finishing Society of Japan\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4139/sfj.75.40\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of The Surface Finishing Society of Japan","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4139/sfj.75.40","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}