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引用次数: 0
摘要
本研究通过一系列器件模拟,研究了栅极和沟道边缘错位对超薄垂直支柱 MOSFET 性能的影响。在实际器件制造过程中,栅极和沟道边缘之间可能经常出现错位,本文定量分析了错位程度对器件工作特性的影响。在栅-沟道重叠的情况下,电流特性几乎没有变化,但当出现过大的欠间隙时,Ion 值会显著下降,Ioff 值会显著上升,并伴随着非理想效应,包括亚阈值摆幅 (S) 下降和漏极诱导势垒降低 (DIBL)。根据这些结果,可以计算出工艺裕度。
Effects of Misaligned Gate Lapping Over the Channel on Performances of Ultra-Thin Vertical-Pillar MOSFET
In this work, the effects of misalignment between gate and channel edges on performances of an ultra-thin vertical-pillar MOSFET are investigated by a series of device simulations. The operation characteristics of the device as a function of degree of misalignment that might frequently exist between the gate and channel edges, in the actual device fabrication, have been quantitatively analyzed. In case of gate-drain overlap, there is little change in current characteristics but significant decrease in Ion and increase in Ioff were observed, when an excessive underlap was established, accompanying non-ideal effects including subthreshold swing (S) degradation and drain-induced barrier lowering (DIBL). Based on the results, the process margin can be figured.