Jiahui Wu , Lei Shi , Jie Liu , Yali Luo , Yunfei Liu , Yinong Lyu
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In-situ copper-loaded hollow porous carbon nanospheres derived from phenolic resin for thermal energy storage
Hollow porous carbon nanospheres (HPCS) are ideal scaffolds for phase change materials in thermal energy storage. However, their synthesis traditionally relies on template-based routes, involving tedious procedures and high costs. This study presents a facile method for preparing HPCS through one-step carbonization of phenolic resin using CuCl2 as the activation agent. This mild activation agent not only helps create a rich porous structure, but also maintains the hollow spherical architecture of the polymer precursor. More importantly, copper ions are reduced to copper nanoparticles during the carbonization process and are in-situ loaded into porous carbon, enhancing the thermal conductivity of the scaffold. After incorporating paraffin, the resulting composite exhibits a high phase change enthalpy of 104.4 J g−1, improved thermal conductivity of 0.95 W m−1 K−1, and excellent thermal cycling stability (100.5 J g−1 after 50 heating-cooling cycles), indicating significant potential for thermal energy storage and management.
期刊介绍:
Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application.
The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta.
The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas:
- New and improved instrumentation and methods
- Thermal properties and behavior of materials
- Kinetics of thermally stimulated processes