Onurcan Kaya, Luigi Colombo, Aleandro Antidormi, Marco A Villena, Mario Lanza, Ivan Cole, Stephan Roche
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引用次数: 0
摘要
具有超低介电常数、良好热性能和机械性能的互连材料对于电子设备的进一步微型化至关重要。最近的研究表明,超薄无定形氮化硼(aBN)薄膜具有极低的介电常数、高密度(高于 2.1 g cm-3)、高热稳定性和机械性能。氮化硼的优异特性源于其无序的性质和程度,而无序的性质和程度可在制造过程中加以控制,从而调整其物理性质以满足所需的应用。在此,我们报告了氢掺杂对 aBN 的稳定性和机械性能的改善。通过在原子模拟中引入高斯近似势,我们研究了 aBN 在不同氢掺杂浓度下的形态变化。我们发现,当氢掺杂浓度为 8 at% 时,sp3 杂化原子的浓度达到最大值,从而使热稳定性和机械性能提高了 20%。这些结果将为实验人员和工艺工程师提供指导,帮助他们调整 aBN 薄膜的生长条件,使其应用于多种领域。
Impact of hydrogenation on the stability and mechanical properties of amorphous boron nitride
Interconnect materials with ultralow dielectric constant, and good thermal and mechanical properties are crucial for the further miniaturization of electronic devices. Recently, it has been demonstrated that ultrathin amorphous boron nitride (aBN) films have a very low dielectric constant, high density (above 2.1 g cm−3), high thermal stability, and mechanical properties. The excellent properties of aBN derive from the nature and degree of disorder, which can be controlled at fabrication, allowing tuning of the physical properties for desired applications. Here, we report an improvement in the stability and mechanical properties of aBN upon hydrogen doping. With the introduction of a Gaussian approximation potential for atomistic simulations, we investigate the changing morphology of aBN with varying H doping concentrations. We found that for 8 at% of H doping, the concentration of sp3-hybridized atoms reaches to a maximum which leads to an improvement of thermal stability and mechanical properties by 20%. These results will be a guideline for experimentalists and process engineers to tune the growth conditions of aBN films for numerous applications.