研究真空热蒸发法制备的酞菁铜 (CuPc) 薄膜的薄层厚度对其结构特性的影响

Laith S. Alhiti, Rafal A. Jawad, Rafaa A. Abd Alwaahed, Hala M. Sobhi
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引用次数: 0

摘要

研究了在不同温度下退火前后制备的不同厚度薄膜的结构特性。研究使用了 X 射线衍射 (XRD)、原子力显微镜 (AFM) 和发射扫描电子显微镜 (FESEM) 来研究结构特性。X 射线衍射分析表明,制备的不同厚度的薄膜以及在 300 K 和 373 K 温度下退火的薄膜均由β相组成,而β相是众所周知的最稳定的相。分析还表明,这种材料具有多晶结构,其特征是单斜晶系。所有薄膜的密度都呈持续增长趋势,所有薄膜的主要趋势都是(312)。原子力显微镜(AFM)测量结果表明,随着薄膜厚度的变化,粗糙度也在增加。此外,在 300 和 373 K 温度下退火的薄膜结晶尺寸增大,但在 473 K 退火温度下,由于薄膜材料的相变,结晶尺寸减小。
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Study of the Effect of Thin Layer Thickness on the Structural Properties of Copper Phthalocyanine (CuPc) Films Prepared by Vacuum Thermal Evaporation Method
The structural properties of thin films prepared with different thicknesses before and after the annealing process and at different temperatures were studied. X-ray diffraction (XRD), atomic force microscopy (AFM), and emission scanning electron microscopy (FESEM) were used to study the structural properties. X-ray diffraction analysis revealed that the thin films prepared with different thicknesses, as well as those annealed at temperatures of 300 and 373 K, were composed of the β-phase, which is widely known as the most stable phase. The analysis also showed that the material has a polycrystalline structure characterized by a monoclinic crystal system. The density shows a constant increase in all thin films, with the dominant trend being (312) for all films. Atomic force microscopy (AFM) measurement results indicated that there was an increase in roughness with a change in the thickness of the thin films. In addition, there was an increase in the crystalline size of the thin films that underwent annealing at 300 and 373 K. However, there was a decrease in crystallite size at the annealing temperature of 473 K due to the phase change of the thin film material.
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