用于控制电磁波的三维/四维打印可重构元表面

IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Proceedings of the IEEE Pub Date : 2024-03-02 DOI:10.1109/JPROC.2024.3391232
Eiyong Park;Minjae Lee;Heijun Jeong;Ratanak Phon;Kyounghwan Kim;Seyeon Park;Sungjoon Lim
{"title":"用于控制电磁波的三维/四维打印可重构元表面","authors":"Eiyong Park;Minjae Lee;Heijun Jeong;Ratanak Phon;Kyounghwan Kim;Seyeon Park;Sungjoon Lim","doi":"10.1109/JPROC.2024.3391232","DOIUrl":null,"url":null,"abstract":"A comprehensive review of 3-D/4-D-printed reconfigurable metasurfaces (RMSs) is presented in this article. A metasurface (MS) demonstrates exceptional abilities for electromagnetic (EM) wave molding beyond that offered by conventional planar interfaces, and RMS provides MS with more diverse EM wave-control capabilities. RMSs are categorized by the type of external stimulus used for reconfiguration, such as electrical RMS, fluidic RMS, mechanical RMS, and thermal RMS. To implement these RMSs, it is important to understand the design and fabrication requirements as well as the EM characteristic of each RMS, including its advantages and disadvantages. In particular, except for electrical RMS, RMSs require complex 3-D structures or special materials that are difficult to implement with conventional subtractive manufacturing methods such as printed-circuit-board manufacturing. Recently, advanced 3-D/4-D printing technology has achieved high fabrication freedom and meets the design and fabrication requirements of each type of RMS. In this article, we introduce representative RMSs with the development of 3-D/4-D printing technology and materials. Furthermore, current issues of RMSs based on 3-D/4-D printing technology and future directions are described.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1000-1032"},"PeriodicalIF":23.2000,"publicationDate":"2024-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"3-D/4-D-Printed Reconfigurable Metasurfaces for Controlling Electromagnetic Waves\",\"authors\":\"Eiyong Park;Minjae Lee;Heijun Jeong;Ratanak Phon;Kyounghwan Kim;Seyeon Park;Sungjoon Lim\",\"doi\":\"10.1109/JPROC.2024.3391232\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A comprehensive review of 3-D/4-D-printed reconfigurable metasurfaces (RMSs) is presented in this article. A metasurface (MS) demonstrates exceptional abilities for electromagnetic (EM) wave molding beyond that offered by conventional planar interfaces, and RMS provides MS with more diverse EM wave-control capabilities. RMSs are categorized by the type of external stimulus used for reconfiguration, such as electrical RMS, fluidic RMS, mechanical RMS, and thermal RMS. To implement these RMSs, it is important to understand the design and fabrication requirements as well as the EM characteristic of each RMS, including its advantages and disadvantages. In particular, except for electrical RMS, RMSs require complex 3-D structures or special materials that are difficult to implement with conventional subtractive manufacturing methods such as printed-circuit-board manufacturing. Recently, advanced 3-D/4-D printing technology has achieved high fabrication freedom and meets the design and fabrication requirements of each type of RMS. In this article, we introduce representative RMSs with the development of 3-D/4-D printing technology and materials. Furthermore, current issues of RMSs based on 3-D/4-D printing technology and future directions are described.\",\"PeriodicalId\":20556,\"journal\":{\"name\":\"Proceedings of the IEEE\",\"volume\":\"112 8\",\"pages\":\"1000-1032\"},\"PeriodicalIF\":23.2000,\"publicationDate\":\"2024-03-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10517411/\",\"RegionNum\":1,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10517411/","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文全面回顾了三维/四维打印可重构元表面(RMS)。元表面(MS)具有超越传统平面界面的电磁波成型能力,而 RMS 则为元表面提供了更多样化的电磁波控制能力。RMS 可根据用于重新配置的外部刺激类型进行分类,如电子 RMS、流体 RMS、机械 RMS 和热 RMS。要实现这些 RMS,必须了解设计和制造要求以及每种 RMS 的电磁特性,包括其优缺点。特别是,除电气 RMS 外,其他 RMS 都需要复杂的三维结构或特殊材料,而传统的减法制造方法(如印刷电路板制造)很难实现这些要求。近年来,先进的三维/四维打印技术实现了较高的制造自由度,可以满足各类 RMS 的设计和制造要求。本文将结合 3-D/4-D 印刷技术和材料的发展,介绍具有代表性的 RMS。此外,还介绍了基于 3-D/4-D 打印技术的 RMS 的当前问题和未来发展方向。
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3-D/4-D-Printed Reconfigurable Metasurfaces for Controlling Electromagnetic Waves
A comprehensive review of 3-D/4-D-printed reconfigurable metasurfaces (RMSs) is presented in this article. A metasurface (MS) demonstrates exceptional abilities for electromagnetic (EM) wave molding beyond that offered by conventional planar interfaces, and RMS provides MS with more diverse EM wave-control capabilities. RMSs are categorized by the type of external stimulus used for reconfiguration, such as electrical RMS, fluidic RMS, mechanical RMS, and thermal RMS. To implement these RMSs, it is important to understand the design and fabrication requirements as well as the EM characteristic of each RMS, including its advantages and disadvantages. In particular, except for electrical RMS, RMSs require complex 3-D structures or special materials that are difficult to implement with conventional subtractive manufacturing methods such as printed-circuit-board manufacturing. Recently, advanced 3-D/4-D printing technology has achieved high fabrication freedom and meets the design and fabrication requirements of each type of RMS. In this article, we introduce representative RMSs with the development of 3-D/4-D printing technology and materials. Furthermore, current issues of RMSs based on 3-D/4-D printing technology and future directions are described.
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来源期刊
Proceedings of the IEEE
Proceedings of the IEEE 工程技术-工程:电子与电气
CiteScore
46.40
自引率
1.00%
发文量
160
审稿时长
3-8 weeks
期刊介绍: Proceedings of the IEEE is the leading journal to provide in-depth review, survey, and tutorial coverage of the technical developments in electronics, electrical and computer engineering, and computer science. Consistently ranked as one of the top journals by Impact Factor, Article Influence Score and more, the journal serves as a trusted resource for engineers around the world.
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