Comparative analysis of thermal interface materials for effective thermal management of electronic devices
Thermal interface materials (TIM) employed to electronic devices enhances interfacial heat dissipation and thermal contact conductance (TCC). This study compares the performance of TIMs (silicon gr...
期刊介绍：
Experimental Heat Transfer provides a forum for experimentally based high quality research articles and communications in the general area of heat-mass transfer and the related energy fields.
In addition to the established multifaceted areas of heat transfer and the associated thermal energy conversion, transport, and storage, the journal also communicates contributions from new and emerging areas of research such as micro- and nanoscale science and technology, life sciences and biomedical engineering, manufacturing processes, materials science, and engineering. Heat transfer plays an important role in all of these areas, particularly in the form of innovative experiments and systems for direct measurements and analysis, as well as to verify or complement theoretical models.
All submitted manuscripts are subject to initial appraisal by the Editor, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. All peer reviews are single blind and submission is online via ScholarOne Manuscripts. Original, normal size articles, as well as technical notes are considered. Review articles require previous communication and approval by the Editor before submission for further consideration.
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