Investigating the Application and Impact of Laser Etching Technology in the Fabrication of Solar Cells

The most crucial initial step in the metallization process of electroplating is the local contact openings in dielectric layers. In this article, an ultraviolet picosecond laser (UV‐ps), is used to open the front and back dielectric layer of the precursor of n‐TOPCon solar cells. By changing the laser parameters and spot overlap rate, the surface morphology of laser etching under different conditions is obtained and characterized by optical microscope and scanning electron microscope. The results indicate that there are three separate laser shock zones in the dielectric layer under the action of Gaussian light spot, and the corresponding ablation mechanisms are proposed. The longitudinal distribution of B element is characterized by secondary ion mass spectrometry to explore the effect of laser on its pn junction. In addition, the electrical characterization of lifetime photoluminescence is measured and calibrated using WCT120, and this indicates that the majority of the amorphous silicon is recrystallized when applying a fast firing oven process, and this hence improve the minority carrier lifetime and implied open‐circuit voltage. The laser damage to the emitter at the laser‐ablated regions is investigated using the emitter saturation current density, J0laser extracted by WCT120.