Compositional Design and Thermal Processing of a Novel Lead-Free Cu–Zn–Al–Sn Medium Entropy Brass Alloy

In the current work, a novel medium entropy copper alloy was designed with the aim of avoiding the use of expensive, hazardous or scarce alloying elements and instead employing widely available and cost-effective alternatives. In order to investigate this unknown region of multicomponent alloy compositions, the thermo-physical parameters were calculated and the CALPHAD method was utilized. This led to the design of the Cu50Zn25Al20Sn5 at. % (Cu53.45Zn27.49Al9.08Sn9.98 wt. %) alloy with a relatively low density of 6.86 g/cm3 compared with conventional brasses. The designed alloy was manufactured through vacuum induction melting, producing two ingots weighing 1.2 kg each, which were subjected to a series of heat treatments. The microstructural evolution of the alloy in the as-cast and heat-treated conditions was assessed through optical and scanning electron microscopy. The hardness of the as-cast and heat-treated alloy at room temperature was also studied. The alloy was characterized by a multiphase microstructure containing a major Cu-rich (Cu–Zn–Al) matrix reinforced with a secondary Zn-rich (Zn–Cu) phase and pure Sn. In terms of mechanical properties, the developed alloy exhibited high hardness values of roughly 378 HV0.2 and 499 HV0.2 in the as-cast and heat-treated conditions, respectively.