电脉冲等离子体烧结中的温度-速率制度对氧化铝微观结构和机械性能的影响:烧结机制的作用

IF 0.5 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY Inorganic Materials: Applied Research Pub Date : 2024-06-03 DOI:10.1134/s2075113324700084
M. S. Boldin, A. A. Popov, A. V. Nokhrin, V. N. Chuvil’deev, A. A. Murashov, G. V. Shcherbak, N. Yu. Tabachkova
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引用次数: 0

摘要

摘要 研究了亚微米和微细氧化铝粉末制成的圆柱形工件的温度和加热速率对收缩动力学的影响。研究涉及三个批次的粉末:(1) 亚微米(约 0.15 µm)α-Al2O3 粉末;(2) 亚微米(约 0.2 µm)α-Al2O3 粉末,其颗粒表面沉积有无定形层;(3) 细(约 1 µm)α-Al2O3 粉末。所有批次的粉末颗粒都具有单晶结构。粉末工件采用电脉冲(火花)等离子烧结(SPS)技术烧结。采用 Young-Cutler 和 Coble 模型分析了收缩曲线。结果表明,工件的烧结动力学取决于粉末颗粒之间的扩散。亚微米粉末工件的烧结动力学取决于晶界扩散的强度。在由细微分散粉末制成的烧结工件中,动力学还取决于同时发展的体积扩散和晶界扩散。研究证实,亚微米级颗粒 αAl2O3 表面无定形层的存在会影响晶粒界面的迁移速度和 SPS 最后阶段的 Coble 方程参数。据推测,用亚微米粉末烧结工件获得的样品,其晶粒生长速度加快,显微硬度增加,且颗粒表面有非晶层,其原因是晶粒界面上的缺陷密度较高。晶粒界面缺陷密度升高可能是无定形层结晶的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Effect of the Temperature-Rate Regimes in Electric Pulse Plasma Sintering on Microstructure and Mechanical Properties of Aluminum Oxide: The Role of Sintering Mechanisms

Abstract

The temperature and heating rate affecting the shrinkage kinetics are studied for cylindrical workpieces obtained from submicron and fine aluminum oxide powder. The studies involve the powder from three batches: (1) submicron (~0.15 µm) α-Al2O3 powder, (2) submicron (~0.2 µm) α-Al2O3 powder having an amorphous layer deposited on the particle surface, and (3) fine (~1 µm) α-Al2O3 powder. It is established that the powder particles in all batches has a monocrystalline structure. The powder workpieces are sintered using the electric pulse (spark) plasma sintering (SPS) technique. The shrinkage curves are analyzed using the Young–Cutler and the Coble models. The kinetics of sintering workpieces is shown to depend on diffusion developing between the powder particles. The sintering kinetics of workpieces made from submicron powder depends on intensity of the grain-boundary diffusion. In the sintering workpieces made of finely dispersed powder, the kinetics is additionally dependent on simultaneously developing volumetric and grain-boundary diffusion. It is established that the presence of an amorphous layer on the surface of particulate α-Al2O3 having submicron size affects the rate of migration of grain interfaces and the parameters of the Coble equation at the final SPS stage. It is assumed that the accelerated growth of grains and an increase in the microhardness of samples obtained through sintering workpieces made from submicron powder with an amorphous layer on the particle surface is caused by a higher density of defects at the grain interfaces. The elevated density of defects at grain interfaces can result from crystallization of the amorphous layer.

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来源期刊
Inorganic Materials: Applied Research
Inorganic Materials: Applied Research Engineering-Engineering (all)
CiteScore
0.90
自引率
0.00%
发文量
199
期刊介绍: Inorganic Materials: Applied Research  contains translations of research articles devoted to applied aspects of inorganic materials. Best articles are selected from four Russian periodicals: Materialovedenie, Perspektivnye Materialy, Fizika i Khimiya Obrabotki Materialov, and Voprosy Materialovedeniya  and translated into English. The journal reports recent achievements in materials science: physical and chemical bases of materials science; effects of synergism in composite materials; computer simulations; creation of new materials (including carbon-based materials and ceramics, semiconductors, superconductors, composite materials, polymers, materials for nuclear engineering, materials for aircraft and space engineering, materials for quantum electronics, materials for electronics and optoelectronics, materials for nuclear and thermonuclear power engineering, radiation-hardened materials, materials for use in medicine, etc.); analytical techniques; structure–property relationships; nanostructures and nanotechnologies; advanced technologies; use of hydrogen in structural materials; and economic and environmental issues. The journal also considers engineering issues of materials processing with plasma, high-gradient crystallization, laser technology, and ultrasonic technology. Currently the journal does not accept direct submissions, but submissions to one of the source journals is possible.
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