编辑:ICASSP 2023 信号处理大挑战特刊

IF 2.9 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE open journal of signal processing Pub Date : 2024-06-24 DOI:10.1109/OJSP.2024.3397168
Alexander Bertrand;Ozlem Kalinli
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引用次数: 0

摘要

2023 年电气和电子工程师学会声学、语音和信号处理国际会议(ICASSP 2023)于 6 月 4 日至 6 月 10 日在希腊罗多斯举行,提交论文和参会人数均创历史新高。自2021年以来,ICASSP一直设有 "信号处理大挑战"(SPGC)项目,该项目已成为该会议的年度亮点。2023 年的 ICASSP 大会从大量提交的论文中精挑细选出 15 个 SPGC,涵盖音频、声学、语音、生物医学信号、通信和图像处理等多个应用领域,数量创下历史新高。已接受的 SPGCs 列表可在 https://2023.ieeeicassp.org/signal-processing-grand-challenges/ 上找到,其中还包括每个挑战的详细信息链接。
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Editorial: Special Issue on the ICASSP 2023 Signal Processing Grand Challenges
The 2023 IEEE International Conference on Acoustics, Speech, and Signal Processing (ICASSP 2023) took place in Rhodos, Greece, running from June 4th to June 10th, with a record number of paper submissions and attendees. Since 2021, ICASSP has featured the “Signal Processing Grand Challenges” (SPGC) program, which has become an annual highlight at the conference. ICASSP 2023 featured a record number of 15 SPGCs, carefully selected from a large number of submissions, and covering a wide variety of application domains, including audio, acoustics, speech, biomedical signals, communications, and image processing. A list of accepted SPGCs can be found at https://2023.ieeeicassp.org/signal-processing-grand-challenges/ , which also includes links to detailed information for each challenge.
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CiteScore
5.30
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0.00%
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审稿时长
22 weeks
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