{"title":"2023 年热销芯片特刊","authors":"Heiner Litz, Natalia Vassilieva","doi":"10.1109/mm.2024.3396008","DOIUrl":null,"url":null,"abstract":"This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"177 1","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Special Issue on Hot Chips 2023\",\"authors\":\"Heiner Litz, Natalia Vassilieva\",\"doi\":\"10.1109/mm.2024.3396008\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.\",\"PeriodicalId\":13100,\"journal\":{\"name\":\"IEEE Micro\",\"volume\":\"177 1\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Micro\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://doi.org/10.1109/mm.2024.3396008\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Micro","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1109/mm.2024.3396008","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.
期刊介绍：
IEEE Micro addresses users and designers of microprocessors and microprocessor systems, including managers, engineers, consultants, educators, and students involved with computers and peripherals, components and subassemblies, communications, instrumentation and control equipment, and guidance systems. Contributions should relate to the design, performance, or application of microprocessors and microcomputers. Tutorials, review papers, and discussions are also welcome. Sample topic areas include architecture, communications, data acquisition, control, hardware and software design/implementation, algorithms (including program listings), digital signal processing, microprocessor support hardware, operating systems, computer aided design, languages, application software, and development systems.
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