用于聚合物微热压花的超声波叠层的设计优化和实验验证

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Micromechanics and Microengineering Pub Date : 2024-07-04 DOI:10.1088/1361-6439/ad5c6e
Ahmed Abdel-Aleem, Ahmed M R Fath El-Bab, Masahiko Yoshino, Hassan A El-Hofy and Mohsen A Hassan
{"title":"用于聚合物微热压花的超声波叠层的设计优化和实验验证","authors":"Ahmed Abdel-Aleem, Ahmed M R Fath El-Bab, Masahiko Yoshino, Hassan A El-Hofy and Mohsen A Hassan","doi":"10.1088/1361-6439/ad5c6e","DOIUrl":null,"url":null,"abstract":"Ultrasonic micro hot embossing (UMHE) is a prominent technique used in numerous sectors to produce micro parts since it is cheaper, faster, and more accurate. Amplitude uniformity is a crucial parameter in UMHE in order to manufacture micro parts with accurate dimensions and high-quality surfaces, even though limited research has been conducted on the uniformity of ultrasonic amplitude at the horn face during the embossing process. This paper presents an experimental and numerical study for designing an ultrasonic transducer and horn tailored to the micro hot embossing of polymer micro parts. A finite element (FE) simulation model combined with the Taguchi method has been developed to optimize the horn geometry and maximum amplitude uniformity. The Taguchi orthogonal array of 25 design runs has been generated and simulated using the developed FE modal analysis model, and then the optimized geometry was used to fabricate the horn. Applied torque and operating time calibrate and evaluate the transducer vibration characteristics. Experimental and simulation results revealed that the fabricated ultrasonic transducer and horn of a straight microfeature has a natural frequency of 28.8 kHz and has an 11 µm average peak-to-peak amplitude with 0.963 amplitude homogeneity along the microfeature face. The achieved frequency separation was greater than 0.85 kHz, whereas the gain ratio was 1.2. The design methodology developed in this paper showed great potential and has been numerically validated for various microfeature shapes across the horn face. Consequently, it can be applied to various ultrasonic applications beyond UMHE.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"24 1","pages":""},"PeriodicalIF":2.4000,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design optimization and experimental verification of ultrasonic stack for micro hot embossing of polymers\",\"authors\":\"Ahmed Abdel-Aleem, Ahmed M R Fath El-Bab, Masahiko Yoshino, Hassan A El-Hofy and Mohsen A Hassan\",\"doi\":\"10.1088/1361-6439/ad5c6e\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ultrasonic micro hot embossing (UMHE) is a prominent technique used in numerous sectors to produce micro parts since it is cheaper, faster, and more accurate. Amplitude uniformity is a crucial parameter in UMHE in order to manufacture micro parts with accurate dimensions and high-quality surfaces, even though limited research has been conducted on the uniformity of ultrasonic amplitude at the horn face during the embossing process. This paper presents an experimental and numerical study for designing an ultrasonic transducer and horn tailored to the micro hot embossing of polymer micro parts. A finite element (FE) simulation model combined with the Taguchi method has been developed to optimize the horn geometry and maximum amplitude uniformity. The Taguchi orthogonal array of 25 design runs has been generated and simulated using the developed FE modal analysis model, and then the optimized geometry was used to fabricate the horn. Applied torque and operating time calibrate and evaluate the transducer vibration characteristics. Experimental and simulation results revealed that the fabricated ultrasonic transducer and horn of a straight microfeature has a natural frequency of 28.8 kHz and has an 11 µm average peak-to-peak amplitude with 0.963 amplitude homogeneity along the microfeature face. The achieved frequency separation was greater than 0.85 kHz, whereas the gain ratio was 1.2. The design methodology developed in this paper showed great potential and has been numerically validated for various microfeature shapes across the horn face. Consequently, it can be applied to various ultrasonic applications beyond UMHE.\",\"PeriodicalId\":16346,\"journal\":{\"name\":\"Journal of Micromechanics and Microengineering\",\"volume\":\"24 1\",\"pages\":\"\"},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2024-07-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micromechanics and Microengineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1088/1361-6439/ad5c6e\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad5c6e","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

超声波微型热压印(UMHE)因其成本更低、速度更快、精度更高,已成为众多行业生产微型零件的重要技术。为了制造具有精确尺寸和高质量表面的微型零件,振幅均匀性是 UMHE 的一个关键参数,尽管对压花过程中喇叭面超声波振幅均匀性的研究还很有限。本文通过实验和数值研究,介绍了如何设计适合聚合物微型零件微热压印的超声波换能器和喇叭。结合田口方法开发了一个有限元(FE)仿真模型,以优化喇叭的几何形状和最大振幅均匀性。使用所开发的有限元模态分析模型生成并模拟了包含 25 个设计运行的田口正交阵列,然后使用优化后的几何形状制造喇叭。应用扭矩和工作时间校准和评估了传感器的振动特性。实验和模拟结果表明,制作的超声波换能器和直微特征喇叭的固有频率为 28.8 kHz,平均峰-峰振幅为 11 µm,沿微特征面的振幅均匀度为 0.963。实现的频率分离大于 0.85 kHz,而增益比为 1.2。本文开发的设计方法显示出巨大的潜力,并对喇叭面上的各种微特征形状进行了数值验证。因此,它可以应用于 UMHE 以外的各种超声波应用。
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Design optimization and experimental verification of ultrasonic stack for micro hot embossing of polymers
Ultrasonic micro hot embossing (UMHE) is a prominent technique used in numerous sectors to produce micro parts since it is cheaper, faster, and more accurate. Amplitude uniformity is a crucial parameter in UMHE in order to manufacture micro parts with accurate dimensions and high-quality surfaces, even though limited research has been conducted on the uniformity of ultrasonic amplitude at the horn face during the embossing process. This paper presents an experimental and numerical study for designing an ultrasonic transducer and horn tailored to the micro hot embossing of polymer micro parts. A finite element (FE) simulation model combined with the Taguchi method has been developed to optimize the horn geometry and maximum amplitude uniformity. The Taguchi orthogonal array of 25 design runs has been generated and simulated using the developed FE modal analysis model, and then the optimized geometry was used to fabricate the horn. Applied torque and operating time calibrate and evaluate the transducer vibration characteristics. Experimental and simulation results revealed that the fabricated ultrasonic transducer and horn of a straight microfeature has a natural frequency of 28.8 kHz and has an 11 µm average peak-to-peak amplitude with 0.963 amplitude homogeneity along the microfeature face. The achieved frequency separation was greater than 0.85 kHz, whereas the gain ratio was 1.2. The design methodology developed in this paper showed great potential and has been numerically validated for various microfeature shapes across the horn face. Consequently, it can be applied to various ultrasonic applications beyond UMHE.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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